Silicone TIF200-02E Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Brand Name:Ziitek
Certification:RoHS
Model Number:TIF200-02E
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Silicone TIF200-02E Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Product descriptions

TlF200-02E series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress application
> Available in varies thickness

> Easy release construction
> Electrically isolating
> Moldability for complex parts


Application

> LED Ceilinglamp
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF200-02E Series
ColorGray / WhiteVisual
Construction Reinforcement CarrierCeramic filled silicone elastomer**********
Thermal Conductivity1.25 W/mKASTM D5470
Hardness35 Shore 00ASTM 2240
Specific Gravity2.2g/ccASTM D297
Thickness range0.020"-0.200" (0.5mm-5.0mm)ASTM D374
Dielectric Breakdown Voltage (T= 1mm above)>5500 VACASTM D149
Dielectric Constant4.0MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Continuous Use Temp– 40 To 160 ℃**********
Outgassing (TML)0.35%ASTM E595
Flame Rating94 V0UL E331100

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm),Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

Vietnam Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


China Silicone TIF200-02E Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink supplier

Silicone TIF200-02E Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

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