TIF100-40-11U Thermal Pad For GPU CPU Chip
Brand Name:Ziitek
Certification:UL and RoHs
Model Number:TIF100-40-11U
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
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Product Details
Company Profile
Product Details
Thermal Pad For GPU CPU Chip
The TIF™100-40-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-40-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features:
> Good thermal conductive: 4.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
> UL recognized
> Moldability for complex parts
> Naturally tacky needing no further adhesive coating
Applications:
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp
| Typical Properties of TIF100-40-11U Series | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density | 3.15g/cm³ | ASTM D297 |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ****** |
| Hardness | 27 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 160℃ | *** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 5.0 MHz | ASTM D150 |
| Volume Resistivity(Ohm-cm) | 1.0X10¹² | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 4.0W/m-K | ASTM D5470 |
Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)
Products Size:
8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company Profile
With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Independent R&D team
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TIF100-40-11U Thermal Pad For GPU CPU Chip
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