CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film

Brand Name:Jingtan
Certification:CE
Minimum Order Quantity:1 set
Delivery Time:60 days
Payment Terms:L/C/T/T
Packaging Details:wooden case packing
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Verified Supplier
Location: Zhuzhou Hunan China
Address: Building B4,Xinma Industrial Park, 959 Tianyi Avenue, Tianyuan District,Zhuzhou City,Hunan Province,China
Supplier`s last login times: within 24 hours
Product Details Company Profile
Product Details
Specification:
Vacuum deposition furnace:
Mainly used for the preparation of carbon-carbon composite materials, and the deposition furnace is mainly used for the preparation of pyrolytic carbon coating on the surface of graphite, semiconductor devices and heat-resistant scour materials.
Parameter /Model No.
JT-0305-C
JT-0505-C
JT-0608-C
JT-0608-C
JT-0812-C
JT-1120-C
JT-1218-C
JT-1520-C
Working Zone Size
φ×H(mm)
300×500
500×500
600×800
600×1200
800×1200
1100×2000
1200×1800
1500×2000
Highest Temperature
(℃)
2300
2300
2300
2300
2300
2300
2300
2300
Temperature uniformity(℃)
±5
±5
±5/±7.5
±7.5/±10
±7.5/±10
±10/±15
±10/±15
±15/±20
Limit Vacuum Degree(Pa)
1-100
1-100
1-100
1-100
1-100
1-100
1-100
1-100
Limit Vacuum Degree(Pa)
0.67
0.67
0.67
0.67
0.67
0.67
0.67
0.67
Heating method
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Design temperature
1250℃/1650℃/1800℃/2200℃
Common temperature
900~1200℃
Vacuum degree
< 50Pa
Pressure rise rate
6.67pA /h(or 150Pa/24h) in cold state of empty furnace
Heating mode
graphite resistance heating or induction heating, independent temperature control, good temperature uniformity
Atmosphere medium
vacuum /CH4/C3H6/H2/N2/Ar
Gas control mode
mass flow meter control, multi-channel gas path, uniform flow field, no deposition dead Angle, good deposition effect;Multi-stage and efficient exhaust treatment system, environmentally friendly, easy to clean up
Furnace type
square, round, vertical or horizontal structure (non-standard design), fully enclosed deposition chamber, good sealing effect,
strong anti-pollution ability;
Furnace cooling mode
furnace shell water cooling, external circulation quick cooling system can be selected, short cooling time, high production
efficiency;
Structure form
horizontal - side discharge, vertical - up/down discharge
Locking mode
manual/automatic
Shell material
inner stainless steel/all stainless steel
Insulation material
carbon felt/graphite felt/carbon fiber cured felt
Infrared instrument
single colorimetric/double colorimetric
Power supply
KGPS/IGBT(only suitable for medium frequency heating)
Product parameter:
China CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film supplier

CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film

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