High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
Brand Name:HOSON
Certification:CE
Model Number:GTS80AH-I
Minimum Order Quantity:1
Delivery Time:25-30
Payment Terms:T/T
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Location:
Shenzhen China
Address:
Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.
Supplier`s last login times:
within 36 hours
Product Details
Company Profile
Product Details
Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder Die Bonding Machine
Strip Die Bonder-Dual Dispensing
Machine Features
● Front-loading and rear-loading methods, compatible with a docking
station, facilitate operator operation and connection, improving
production cycle time;
● Utilizes internationally leading dual die bonding, dual
dispensing, and dual wafer search systems;
● Utilizes a direct-drive motor to drive the bonding head;
● Utilizes a linear motor to drive the wafer search platform (X/Y)
and feed platform (B/C);
● Utilizes an automatic angle correction system for the wafer
frame;
● Equipped with an automatic wafer ring loading and unloading
system, effectively improving production efficiency;
● Precision automation equipment effectively ensures that
businesses improve production efficiency and reduce costs, thereby
effectively enhancing their competitiveness.
Mainly used in flip-chip applications such as 0.5-meter flexible light strips
Cycle: 150ms
Product specification
| Production Cycle | 150ms cycle depends on chip size and bracket |
| XY Accuracy | ±1mil(±0.025mm) |
| Die Rotation | ±3° |
| Die XY Workbench | |
| Die Dimensions | 3mil×3mil-80mil×80mil (0.076mm*0.076mm-2mm*2mm) |
| Max. Angle Correction | ±15° |
| Max. Die Ring Size | 6″ (152mm) outer diameter |
| Max. Die Area | 4.7″ (119mm) after expansion |
| Resolution Ratio | 0.04mil (1μm) |
| Thimble Z Height Stroke | 80mil(2mm) |
| Image Recognition System | |
| Grey Scale | 256 (Level Grey) |
| Resolution | 720(H)×540(V)(Pixels) |
| Die Bonder’s Swing Arm-and-hand system | |
| Swing Arm of Die Bonder | 105° rotatable die bonding |
| Die Bond Pressure | Adjustable 30g-250g |
| Loading Workbench | |
| Range of Stroke | 500mmx120mm |
| XY Resolution | 0.02mil(0.5μm) |
| Suitable Holder’s Size | |
| Length | 300mm-500mm |
| Width | 80mm-120mm |
| Facilities Needed | |
| Voltage/Frequency | 220V AC±5%/50HZ |
| Compressed Air | 0.5MPa(MIN) |
| Rated Power | 1200W |
| Gas Consumption | 40L/min |
| Volume and Weight | |
| Length x Width x Height | 1900×980×1620mm |
| Weight | 1200KG |
Applications:
For LED packaging, screen display field, consumer electronics, smart home, intelligent lighting and other fields of high-precision & high-speed solidification equipment.
Applicable products: LED 2835,5050,21211010,0603,020, semiconductor and COB LED products such as solid crystal.
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
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