Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine
Brand Name:GKG
Certification:CE
Model Number:GD602D
Minimum Order Quantity:1
Delivery Time:20-25
Payment Terms:T/T
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Location:
Shenzhen China
Address:
Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.
Supplier`s last login times:
within 36 hours
Product Details
Company Profile
Product Details
Fully Automatic Smt Production Line Flip Chip Die Bonder Machine For COB Strip Light and Semiconductor Packaging Chip Mounting Electronics Machinery
High-Speed Flexible Strip Die Bonder
Product Features
1. Utilizes a sheet-to-sheet docking station with dual swing arms
for 180° cross-bonding.
2. Compatible with a printer to enable a variety of in-line process solutions.
3. Fully integrated carrier from loading, printing, to die bonding and placement.
4. The carrier supports 0.5M materials, and mid-process transfers are accomplished using a docking station.
5. Equipped with a variety of practical features, including automatic calibration, automatic die ring changer, and a feeder-style quick-release workbench.
Product specification
| Speed of die attach | ≥60ms UPH: 60K/h (actual production capacity depends on wafer and substrate size and process requirements) |
| Position accuracy of die attach | ± 1 mil (± 25um) |
| Angle accuracy of wafer | ± 1 ° |
| Crystal loss detection function | With (vacuum detection mode) |
| Solid leakage detection function | With (vacuum detection mode) |
| Capacity statistics function | Yes |
| Statistical function of consumables usage | Yes |
| Function of parameter modification record | Yes |
| User privilege management function | Yes |
| Module of wafer worktable | |
| Size of the chip | 3milx5mil-60mlx60mil |
| Thickness of the wafer | 0.1-0.7 mm |
| Maximum correction angle of wafer | ± 15 ° |
| Maximum size of wafer and wafer ring | 6“Crystal Ring (152 mm outer diameter) .” |
| Maximum area size of wafer | 4.7“(119 mm) |
| Maximum travel of worktable | 152MMX152MM |
| XY resolution | 0.5 um |
| Thimble height travel in z direction | 3 mm |
| Thimble cap | Single Needle (with) |
| Motor and drive system | Home-made linear motor & Huichuan District Drive |
| Image recognition system | |
| Methods of image recognition | 256 grayscale |
| Image resolution | 720 * 540 |
| Accuracy of image recognition | ± 0.025 Mil@50 Mil observed range |
| Foolproof function of chip | Yes |
| Pre-consolidation testing function | Yes |
| Post-consolidation image detection function | Yes |
| Mode of feeding | Automatic connection of incoming and outgoing materials |
| Solid Crystal Swing Arm System | |
| The way of fixing crystal | Double Swing Arm 180 ° rotation solidification |
| Suction pressure of crystal | 30g-250g adjustable |
| Manual adjustment of suction nozzle vacuum sensitivity | Yes |
| Module of substrate workbench | |
| Mounting speed | 5000-6000UPH |
| Range of travel of worktable | 140mmx620mm |
| Adapt to the width of the substrate | 60-120mm |
| Adapt to the length of the substrate | 100-600mm |
| Thickness of substrate | 0.1-2mm |
| XY resolution | 0.5um |
| Motor and drive system | Home-made Linear Motor & Huichuan District Drive |
| Fixing method of base plate | Manipulator plus vacuum suction platform |
Applications:
Product application
COB flexible lamps are mainly used in smart home, intelligent
lighting, car decoration, intelligent decoration and other
applications.
Applicable products: Flexible Lamp Belt (FPC, PCB, BT) , SMD, resistors, IC components and other flip-chip products solid crystal.
Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine
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