Automatic/Semi-automatic PCB Guide Hole Drilling Machine

Description

Specially developed for guide hole punching of various single-sided and double-sided PCBs, this system features high-resolution CCD automatic target alignment, automatic panel positioning, and burr-free punching across the entire area in one pass. It is also equipped with an automatic handling mode for missing targets. The positive-negative recognition mode adapts to various board materials and target types. The drill bit life warning function ensures stable drilling quality, while the data storage management allows easy adjustment of settings. The adjustable suction cup for material handling can accommodate various sizes, and even warped materials can be handled without concern.

Available in semi-automatic, high-efficiency, and high-precision models, with customizable Chinese or English interfaces.

Specifications

High-Resolution CCD Camera For Automatic Target Alignment

The high-speed linear guide motion platform moves quickly along the X and Y axes, while the high-resolution CCD camera (768x576 pixels) easily locks onto target patterns. The self-developed analysis software can recognize any type of target, with recognition speed of less than 0.5 seconds.

Burr-Free, One-Pass Hole Punching Across The Entire Area – No Rework Needed

With high-precision ball screw drive and a 60,000 RPM spindle, the drilling speed reaches 70 to 80 holes per minute. The recognition and punching of a single target take less than 0.5 seconds. The system allows for selection between cylinder punching or motorized punching modules, adapting to the target punching needs of different precision PCB materials.

Top And Bottom Dust Removal Modules Ensure Clean Surfaces And Prevent Board Wear

Customers can independently choose the upper and lower dust extraction modules, along with a self-contained dust collection system, ensuring a clean surface without debris. Combined with a flat granite work surface, it guarantees no wear on the PCB during processing.

Fully Automated Printing Mode, Fast And Seamless Operation

Applications:

1. High-Volume Manufacturing
Automatic Machines: Ideal for mass production, utilizing CNC technology for continuous, efficient operation with minimal human oversight. They excel in environments requiring consistent output and high throughput.
Semi-Automatic Machines: Suitable for moderate batches, offering flexibility for occasional design changes without full automation costs.

2. Precision and Complexity
Automatic: Ensure micron-level accuracy for multi-layer PCBs and micro-vias, critical in advanced electronics like smartphones and medical devices.
Semi-Automatic: Provide adequate precision for simpler designs but may require manual adjustments for complex layouts.

3. Multi-Layer and HDI Boards
Automatic: Adjust drilling depth dynamically for layer-to-layer connections (blind/buried vias), essential in high-density interconnect (HDI) designs.
Semi-Automatic: Require operator input for layer-specific parameters, limiting scalability for intricate multi-layer projects.

4. Flexible and Rigid-Flex PCBs
Automatic: Use specialized drill bits and adaptive speed control to handle delicate flexible materials without damage.
Semi-Automatic: Depend on operator expertise to adjust settings, posing challenges for consistency in flex circuits.

Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries. We specialize in the design, production, and customization of full-line SMT equipment, supported by installation, software training, and exceptional after-sales service. Our commitment to innovation, quality, and customer satisfaction has made us a trusted partner for businesses worldwide.

We offer a complete range of SMT machines and solutions, including: SMT Pick and Place Machines, Solder Paste Printers, Reflow Oven Machines, 3D AOI (Automated Optical Inspection) Machines, 3D SPI (Solder Paste Inspection) Machines, Wave Soldering Machines, DIP Insertion Lines, THT Component Insertion Machine, UV Conformal Coating Machine, PCB Glue Dipensing Machine, UV Curing Furance Machine, BGA (Ball Grid Array) Machines, SMT Loader and Unloader Machines, Customized OEM and ODM Equipment.