Customized LM561C LED PCB with 660nm Osram LED 1-3oz Copper Thickness and 0.8-1.6mm Board Thickness
Brand Name:HS
Certification:CE UL ROHS ISO9001
Model Number:LM561C LED PCB
Minimum Order Quantity:2
Place of Origin:Guangdong, China
Price:$12
Verified Supplier
Location:
Dongguan China
Address:
Address: 8th floor,Jinlong Bldg., Xiaobian, Chang'an Town, Dongguan,China
Supplier`s last login times:
within 32 hours
Product Details
Company Profile
Product Details
customized LM561C LED PCB with 660nm osram led pcb
We can do for you:
♦ 1—12 layer FR4 PCB,1 layer Aluminum PCB,1-4 layer Flexible PCB.
♦ 1—3oz copper thickness.
♦ 0.2mm hole size.
♦ 0.1mm track width/space.
♦ SMT PCBA service.
FAQ:
Q:1.Can i have a sample to test?
A:Yes,we can send you samples to test.
Q:2.What specifications do you need for PCB quotation?
A:We need your PCB Gerber file,board thickness,copper
thickness,surface finishing and quantity to quote you.
Q:3.What is the lead time?
A:Samples need 3-5days,mass production needs 7-10days,also according
to the order volume.
Q:4.Do you have MOQ limit?
A:Even 1 pcs,we care.
Q:5.Can you offer the best price for us?
A:Yes,we are specialized PCB manufacturer directly,we can offer lower
price than any trading company.
Q:6.How do you ship the goods and how long does it take arrival?
A:We usually ship by DHL,UPS,FedEx and TNT.It takes 3-5days to
arrive.
Q:7.What are the payment terms?
A:You can pay us with Paypal,Western Union and T/T Bank.
Q:8.Can we visit your factory?
A:Yes,welcome to visit our factory anytime,and we will lead you to
visit our factory and our production line.
Manufacturing Capability:
item | Manufacture Capability |
Material | FR4,CEM-1, Aluminium, Polyamide |
Layer No. | 1-12 |
Finished board thickness | 0.1 mm-4.0mm |
Board Thickness Tolerance | ±10% |
Cooper thickness | 0.5 OZ-3OZ (18 um-385 um) |
Copper Plating Hole | 18-40 um |
Impedance Control | ±10% |
Warp&Twist | 0.70% |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
Images |
Min Trace Width (a) | 0.075mm (3mil) |
Min Space Width (b) | 0.1mm (4 mil) |
Min Annular Ring | 0.1mm (4 mil) |
SMD Pitch (a) | 0.2 mm(8 mil) |
BGA Pitch (b) | 0.2 mm (8 mil) |
Solder Mask |
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
Solder mask Clearance (b) | 0.1mm (4 mil) |
Min SMT Pad spacing (c) | 0.1mm (4 mil) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Holes |
Min Hole size (CNC) | 0.2 mm (8 mil) |
Min Punch Hole Size | 0.9 mm (35 mil) |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Hole Position Tol | ±0.075mm |
Plating |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Outline |
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
Beveling | 30°45° |
Gold Finger angle | 15° 30° 45° 60° |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
Company Profile
Specialized in Aluminum Substrates & Copper Substrates Production:
High-Efficiency Heat Dissipation, Conquer Extreme Environments
Focused on R&D and manufacturing of high-performance thermal
management substrates, we provide industrial-grade solutions with
aluminum substrates and copper substrates for high-power and
high-heat applications. Core Technical Advantages:
✅ Exceptional Thermal Performance: Aluminum substrates feature
metal-core copper clad technology with thermal conductivity of
1.5–2.0 W/m·K, while copper substrates deliver over 300 W/m·K
thermal conductivity, rapidly dissipating heat to ensure equipment
stability.
✅ High Reliability: Withstands extreme temperatures (-50°C to
200°C), anti-corrosion, and meets stringent standards for
automotive electronics, aerospace, and other harsh environments.
✅ Customizable Designs: Supports thick copper layers (3oz–10oz),
irregular cutting, and 3D packaging, ideal for LED lighting, new
energy inverters, and high-power power supplies. Applications:
✔️ LED Lighting: High-power streetlights, stage lights, automotive
headlights;
✔️ New Energy Vehicles (NEVs): Motor controllers, onboard chargers
(OBC);
✔️ Industrial Equipment: Inverters, servo drives, solar inverters.
Why Choose Us?
✔️ Rigorous Quality Control: Fully automated production + 100%
thermal cycling testing;
✔️ Fast Delivery: Custom small-batch + mass production with 30%
shorter lead times;
✔️ Cost Optimization: Mature processes + localized supply chain
for industry-leading pricing. Empowering High-Power Technology with
Metal Substrates! (Contact: Phone/Email/Website) Key Highlights of
This Copy:
Focuses on core selling points (thermal performance, extreme
environment adaptability);
Targets high-growth industries like NEVs and industrial
automation;
Data-driven (thermal conductivity, temperature range) for
credibility; Emphasizes customization and fast delivery to meet
industrial client needs.