Product Details
Custom Electronic Design Manufacturing Assembly-Mobile Phone Charger Power Bank PCB PCBA Control Board
Specification:
Quality Standard
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IAFT 16949 Tier 1 Manufacturer
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Traceability
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QR Code Laser printing in MES system
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Max Stencil Size
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1560mm*450mm
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Min SMT Package
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0201
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Min IC Pitch
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0.3mm
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Max PCB Size
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1200mm*400mm
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Min PCB Thinkness
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0.35mm
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Min Chip Size
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01 005
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Max BGA Size
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74mm*74mm
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BGA Ball Pitch
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1.0-3.00
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BGA Ball Diameter
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0.2 - 1.0mm
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QFP Lead Pitch
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0.2mm-2.54mm
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SMT Capacity
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6 million points per day
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Change Line Time
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Within 30 minutes
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DIP Capacity
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Automatic Wave soldering, 6000 sets per day
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dispensing
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Selective dispensing
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Conformal coating
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Automatic coating
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Test
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AOI, IC programming, ICT, FCT,Function test
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Aging
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High temperature, Low Temperature
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Conformal coating
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Automatic coating
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Housing
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Automatic assembly line,Automatic screw
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PCB Specification
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FR-4,1.6mm tickness,1OZ,2-10Layer HDI stackup,HASL-LF
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Processor
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ARMCortex-M4,168MHz
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Memory
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128KBRAM,512KBFlash,MicroSD slot(up to32GB)
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Power Consumption
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3.3V,<1μA static,<30mA dynamic
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Connectivity
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Wi-Fi,BLE 4.2 Ethemet(10/100Mbps)
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I/OInterfaces
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32GPIO.6ADC(12-bit).8PWM.12C,SP1.UART
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Signal Processing
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0-3.3V analog input,DSP instructions
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Temperature Range
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-40°Cto+85°operating,-40°Cto+125Cstorage
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Physical Size
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50mm×30mm×2mm
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Development Environment
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C,C++,Python,Arduino IDE,PlatformlO
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Security Features
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AES-128,SHA-256,SecureBootTamper-proofdesign
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Certifications
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RoHS
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Additional Features
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Deepsleepmode,RTC with battery back up,built-in Additional Features
temperature/humidity sensor,expansion header pins
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