Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue
Brand Name:Hanast
Certification:ROHS SGS
Model Number:HN-5508AB
Minimum Order Quantity:1KG
Delivery Time:5-7days
Payment Terms:T/T, D/A, D/P
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Location:
Shenzhen Guangdong China
Address:
1210, Block B, Building 6, Hengda Shishang Huigu, Shenzhen, Guangdong, China
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within 1 hours
Product Details
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Product Details
Silicone Manufacturer Flame Retardant Epoxy Potting Glue For Temperature Sensors Controllers Ignition Coils Epoxy Electronic Potting Glue 5:1 Epoxy Potting Compounds
Product Description:
HN-5508A/B epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness
Technical Parameter
| curing | builder | Epoxy resin 5508A | Curing agent 5508B |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
processabiliy | mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm | 14 1.2*10 | ||
| Volume resistance ofΩ-cm | 15 1.1*10 | ||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
distortion temperature ℃ | 130-150 |
| low temperature resistant ℃ | -30 |
Product Feature :
HN-5508AB has insulation, flame retardant, and temperature resistance. It has flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance
How to use:
matters need attention:
1. This product is an AB agent, according to the label ratio on the product package, and the mixing ratio is weight ratio and non-volume ratio.
2, AB agent mixing can not be stirred with a round bar without resistance, must be stirred with a flat tool with resistance, it is best to use a small mixer.
3. This product should be placed in a cool and dry place to avoid light, keep the workshop dust-free, and cover the unused glue after opening the lid in time.
4. The performance test data is the test result when the humidity is 60% and the temperature is 25℃, for customer reference only.
5, resin glue stored in a wet environment will exhibit a crystallization phenomenon, please put it in the oven at a low temperature hot dry, and restore its original state.
Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue
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