Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃
Brand Name:Jietai
Certification:CE, FCC, ROHS, etc.
Model Number:JTM-100504AD
Minimum Order Quantity:1
Delivery Time:30-60work days
Payment Terms:T/T
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Dongguan Guangdong China
Address:
2nd Floor, Unit 2, Building 16, No. 7, Science and Technology Avenue, Houjie Town, Dongguan City, Guangdong Province
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Product Introduction: Semiconductor Silicon Wafer Cleaning System
Tailored for high-precision semiconductor manufacturing, this
integrated cleaning system combines multi-stage ultrasonic
processes to deliver sub-ppb level surface purity, a critical
prerequisite for silicon wafer fabrication in advanced node (≤7nm)
microelectronics production.
Stage-by-Stage Cleaning Mechanism:
- Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.
- Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).
- Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.
Technical Specifications:
- Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)
- Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress
- Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding
Core Performance Metrics:
- Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants
- Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)
- Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration
Application: Essential for pre-litho, post-CMP, and pre-implant cleaning in
logic, memory, and sensor wafer production lines.
Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning,
UPW rinsing, 40-80KHz, 60℃ process, silicon wafer decontamination
This system ensures consistent cleaning performance to maximize
yield in high-volume semiconductor manufacturing environments.
Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃
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