40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 60℃
Brand Name:Jietai
Certification:CE, FCC, ROHS, etc.
Model Number:JTM-100504AD
Minimum Order Quantity:1
Delivery Time:30-60work days
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
2nd Floor, Unit 2, Building 16, No. 7, Science and Technology Avenue, Houjie Town, Dongguan City, Guangdong Province
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within 5 hours
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Product Details
Product Introduction: Semiconductor Silicon Wafer Cleaning System
Tailored for semiconductor manufacturing workflows, this precision
cleaning system integrates multi-stage ultrasonic processes to
achieve ultra-high surface purity of silicon wafers, critical for
ensuring device yield and performance in IC fabrication and MEMS
processing.
Core Cleaning Stages:
- Ultrasonic Alkaline Cleaning: Utilizes cavitation effect at adjustable frequencies to dissolve organic residues, photoresist remnants, and particulate contaminants from wafer surfaces and microstructures, preparing substrates for subsequent acid treatment.
- Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxide layers) via frequency-optimized ultrasonic energy, enhancing chemical reactivity to dislodge submicron contaminants embedded in patterned structures or wafer edges.
- DI Water Rinsing: Implements high-purity deionized water circulation to eliminate residual chemicals, ensuring surface neutrality and meeting strict conductivity standards (≤18.2MΩ·cm) required for advanced semiconductor processing.
Technical Parameters:
- Ultrasonic Frequency Range: 40KHz-80KHz (multi-band adjustable, enabling precise matching to contamination types and wafer geometries)
- Process Temperature: 60℃ (thermostatically controlled to optimize chemical reaction rates while preventing wafer damage)
- Material Compatibility: Constructed with PFA-lined tanks and quartz components to resist corrosive chemistries, avoiding secondary contamination.
Key Advantages:
- Achieves sub-50nm particle removal efficiency, compliant with SEMI F020 standards
- Frequency-tunable ultrasonic modules adapt to bare wafers, patterned wafers, and thin films
- Integrated temperature control ensures consistent cleaning efficacy across batch processing
- Seamless integration with upstream wafer handling systems and downstream lithography/etching processes
Application: Ideal for pre-diffusion, pre-deposition, and post-etch cleaning
in 4-inch to 12-inch silicon wafer manufacturing lines.
Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning,
DI water rinsing, 40-80KHz, 60℃ process, silicon wafer surface
treatment
40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 60℃
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