Thermal Grease Shin-Etsu X-23-7921-5 For High Performance Processors

Brand Name:ShinEtsu
Certification:TDS,SDS,Rohs
Model Number:ShinEtsu X-23-7921-5
Minimum Order Quantity:1
Delivery Time:5-8days
Payment Terms:T/T,L/C,D/A,D/P,Western Union,MoneyGram
Contact Now

Add to Cart

Verified Supplier
Location: Dongguan Guangdong China
Address: 101, No. 130 Fengping Road, Shitouling Industrial Zone, Wulian Village, Fenggang Town, Dongguan City, Guangdong Province, China
Supplier`s last login times: within 28 hours
Product Details Company Profile
Product Details

Shin-Etsu X-23-7921-5 Thermal Grease for High-Performance Processors


Product Introduction: Shin-Etsu X-23-7921-5 Thermal Grease

Basic Properties

Shin-Etsu X-23-7921-5 is a non-solvent thermal interface material designed for high-performance microprocessors. It fills air gaps between processors and heat sinks to enhance thermal efficiency, featuring high thermal conductivity (>6.0 W/m·K) and low thermal resistance (<7.0 mm²·K/W). The gray paste has a viscosity of 360 Pa·s at 25°C.



Product Description

Developed by Shin-Etsu Chemical, X-23-7921-5 minimizes interfacial thermal resistance by evenly coating processor-heat sink interfaces. Its formulation achieves a bond line thickness (BLT) of 25μm at 20psi, with minimal volatility (0.44% after 24hrs at 50°C). Available in syringes, cartridges, and bulk packaging for manual or automated applications.



Key Features

  • High Thermal Conductivity: >6.0 W/m·K, far surpassing air (0.027 W/m·K).
  • Low Thermal Resistance: <7.0 mm²·K/W at 20psi.
  • Stability: Specific gravity 2.5 with low volatility for long-term reliability.
  • Precision Compatibility: BLT maintained at 25~41μm under 5.2~52.2psi pressure.

Applications

Applications include CPU/GPU cooling, servers, automotive electronics, and high-power LED modules. Its low thermal resistance suits thin-profile devices (e.g., laptops) and industrial equipment requiring sustained high-temperature operation.



Technical Specifications

PropertyValueUnit
Viscosity @25°C360Pa·s
Thermal Conductivity>6.0W/m·K
Thermal Resistance @20psi<7.0mm²·K/W
Bond Line Thickness @20psi25μm
Volatile Content (50°C/24h)0.44%
Specific Gravity2.5-

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination

China Thermal Grease Shin-Etsu X-23-7921-5 For High Performance Processors supplier

Thermal Grease Shin-Etsu X-23-7921-5 For High Performance Processors

Inquiry Cart 0