Dowsil 7920LV One Part Thermal Die Attach Adhesive In Microelectronics Packaging

Dowsil 7920LV High-Performance One-Part Thermal Die Attach in Microelectronics Packaging

Basic Product Attributes

DOWSIL™ 7920-LV Die Attach Adhesive is a one-part, black, thixotropic silicone adhesive with self-priming capability. It cures upon heating for flexible processing, features a low modulus to minimize stress, offers optimized viscosity for ease of dispensing, and is solventless to reduce voiding potential.

Product Description

DOWSIL™ 7920-LV is a high-performance silicone material specifically formulated for microelectronic die attach applications. Its core composition is based on Polydimethylsiloxane (PDMS). Once cured, it retains excellent stability in physical and electrical properties over a broad range of operating conditions, significantly enhancing the long-term reliability and service life of packaged assemblies. Its stable chemistry and versatile processing options provide substantial user benefits.

Key Advanced Properties

Key advantages of this adhesive lie in its ​​low modulus design​​ (Tensile Modulus ~6.8 MPa), which effectively absorbs and dissipates stresses induced by coefficient of thermal expansion (CTE) mismatch, protecting sensitive dies and substrates. Its ​​optimized thixotropy​​ (Thixotropic Ratio 2.3) ensures excellent shape retention during dispensing, preventing sag, and is ideal for precision application. The ​​self-priming feature​​ enables strong adhesion to commonly used microelectronics substrates (e.g., aluminum, Lap Shear ~7.3 MPa). As a ​​solventless one-part​​ system, it eliminates mixing steps, simplifies operation, and minimizes the risk of void formation during cure.

Application Scenarios

DOWSIL™ 7920-LV is designed for microelectronics packaging requiring high-reliability bonding and good thermal performance. Its low viscosity and low modulus make it particularly suitable for attaching small, thin dies (e.g., thin silicon dies, GaAs dies) and for applications sensitive to thermomechanical stress. Typical applications include:

• ​​Power Semiconductor Packaging:​​ Die attach for MOSFETs, IGBTs, Power Diodes, where low stress protects die integrity.
• ​​Optoelectronic Device Packaging:​​ Attaching LED dies, optical sensors, providing stable mechanical support and a thermal conduction path.
• ​​Sensor & MEMS Packaging:​​ Low modulus minimizes detrimental packaging stress on sensor accuracy.
• ​​Other High-Reliability Microelectronics Assembly:​​ Suitable for advanced packaging forms requiring stable bonding and good electrical insulation.

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination

Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives across various industries such as electronics, home appliances, LED lighting, automotive, consumer electronics, rail transit, aerospace, and electrical power. Huazhisheng New Materials adheres to the corporate sustainable development strategy of "Progress, Innovation, Professionalism, and Integrity," and integrates the philosophy of "Quality, Efficiency, Environment-Friendly, and Reliability" throughout the entire product lifecycle. Our products have passed SGS, UL, FDA, DIN, and non-toxic certifications, and have been awarded multiple global patents, making us one of the primary suppliers of adhesives and new materials in China's new energy, electronics, automotive, industrial, packaging, environmental protection, construction, and high-speed rail sectors.
With an innovative perspective, we offer customized solutions, continuously develop leading technologies, and provide comprehensive support to clients across various industrial sectors. We are committed to collaborating with our clients to drive industrial transformation and upgrading, ensuring your sustained competitive edge.
Based on advancements in various polymer chemical materials, Huazhisheng New Materials has established a leading position in four key areas: coating, bonding, sealing, and thermal conductivity. Our efficient and environmentally friendly adhesive products and technical solutions help industrial enterprises enhance production efficiency and benefits, protect your electronic products from external chemical agents and harsh usage environments, and extend their lifespan, ensuring continuous and stable operation.