

Add to Cart
Dowsil CN-8760 Thermally Conductive Encapsulant Gray Elastomer Moderate Thermal Conductivity
Product Overview
Dowsil CN-8760 is a two-part, thermally conductive encapsulant
designed for applications requiring efficient heat dissipation and
electrical insulation. This gray elastomer offers a low viscosity
formulation, easy mixing, and room temperature curing, making it
suitable for a wide range of electronic and electrical assembly
applications.
Product Description
Dowsil CN-8760 is a versatile encapsulant that cures to a flexible
elastomer without exotherm, ensuring consistent performance
regardless of the thickness or confinement of the application. It
is primerless, requiring only proper surface cleaning for adhesion,
and provides excellent thermal conductivity to aid in heat
dissipation. The product is UL 94 V0 certified, ensuring compliance
with flammability standards, and offers a balanced combination of
mechanical and electrical properties for reliable performance in
demanding environments.
Special Properties
Dowsil CN-8760 stands out for its 1:1 mixing ratio, which
simplifies the manufacturing process and allows for some variation
in dispense equipment. It cures at room temperature or with heat
acceleration, providing flexibility in processing. The cured
material has a Shore A durometer of 52, offering a balance between
hardness and flexibility. Its thermal conductivity of 0.66 W/mK
ensures effective heat transfer, while its low dissipation factor
and high dielectric strength make it suitable for electrical
insulation applications. The product is also compatible with a wide
range of materials, though care should be taken to avoid inhibitors
such as organotin compounds and sulfur-containing materials.
Application Scenarios
Dowsil CN-8760 is commonly used in power modules, adaptors,
inverters, transformers, ballasts, sensors, and electric control
units. Its thermal conductivity and electrical insulation
properties make it ideal for protecting sensitive electronic
components while ensuring efficient heat dissipation. The product
is also suitable for applications requiring primerless adhesion and
fast processing times, such as in high-volume manufacturing
environments.