Electronic PCB Assembly Power Supply High Quality PCBA
Minimum Order Quantity:1
Payment Terms:T/T
Price:Inquiry Us
Layer:8 Layer
Material:FR4
Min. Component Size:0201
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Shenzhen China
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Yasen Industrial Park, Baolong Street, Longgang District, Shenzhen
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Electronic PCB Assembly Power Supply High Quality PCBA
♦ What is Electronic PCB Assembly?
Electronic PCB Assembly, or Printed Circuit Board Assembly (PCBA), is the complete process of mounting and soldering electronic components onto a bare PCB to create a functional electronic circuit. It transforms the fabricated board (with copper traces and pads) into a working module ready for integration into devices.
Key Stages of PCB Assembly:
- Component Sourcing
Procuring certified parts (resistors, ICs, connectors, etc.) from suppliers, often with traceability for quality control. - Solder Paste Application
A stencil printer applies solder paste (a mix of flux and tiny solder balls) precisely onto pads where components will sit. - Pick-and-Place
High-speed robotic machines place components onto the paste-covered pads, using optical alignment for micron-level accuracy (e.g., 0201 resistors, BGA chips). - Reflow Soldering
The board passes through a controlled oven with temperature zones (preheat, thermal soak, reflow, cooling) to melt the paste, forming permanent joints. Lead-free solder (e.g., SAC305) requires higher temperatures (240–250°C). - Inspection & Testing
- AOI (Automated Optical Inspection): Cameras detect misaligned parts, solder bridges, or missing components.
- X-ray: Checks hidden joints (e.g., BGAs).
- ICT (In-Circuit Test): Probes test electrical continuity, resistance, and component values.
- Functional Test: Validates the board under real-world conditions (e.g., firmware loading, signal integrity).
- Through-Hole Assembly (if needed)
For components like electrolytic capacitors or connectors, manual or wave soldering inserts leads through drilled holes. - Conformal Coating & Final Assembly
Protective coatings (e.g., acrylic, silicone) shield against moisture/dust. Boards may then be integrated into enclosures with cables, heat sinks, etc.
♦ DQS's PCB Assembly Capability
Item | Normal | Special | |||
SMT Assembly | PCB(for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L＜2mm |
Maximum | L≤800mm, W≤460mm | L ＞ 1200mm, W＞500mm | |||
Thickness( T) | Thinnest | 0.2mm | T＜0.1mm | ||
Thickest | 4 mm | T＞4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm＜T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | ||
DIP Assembly | PCB specification | Length and Width ( L* W) | Minimum | L≥50mm, W≥30mm | L＜50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T＜0.8mm | ||
Thickest | 3.5mm | T＞2mm | |||
♦ One-Stop Electronic Manufacturing Including
PCB Prototype | Quick Turn PCB | Single-Sided PCB | Double-Sided PCB | Multilayer PCB | Rigid PCB |
Flexible PCB | Rigid-Flex PCB | Rigid-Flex PCB | Aluminum PCB | Metal Core PCB | Thick Copper PCB |
HDI PCB | BGA PCB | High TG PCB | PCB Stencil | Impedance Control PCB | PCB Assembly |
| High-Frequency PCB | Bluetooth Circuit Board | Automotive PCB | USB Circuit Board | Halogen-Free PCB | Antenna PCB |
♦ Core Competencies of DQS PCB Assembly
Electronic PCB Assembly Power Supply High Quality PCBA
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