Metal Core PCB Circuit Board Production Thick Copper Printed Circuit Board Manufacturer

Metal Core PCB Circuit Board Production Thick Copper Printed Circuit Board Manufacturer

♦ What is Metal Core PCB?

A Metal Core PCB (MCPCB)—also called an IMS (Insulated Metal Substrate)—is a printed-circuit board whose base layer is a thick metal plate (almost always aluminum, sometimes copper or steel) instead of the traditional FR-4 fiberglass. A thin dielectric (5–150 µm) is bonded on top of the metal to isolate the copper circuit layer while still conducting heat efficiently.

♦ Key Points of Metal Core PCB

1.Purpose: move heat away from hot components (LEDs, power MOSFETs, IGBTs, laser diodes, automotive ECUs).

2. Layer stack-up (single-side example):

• Silk / solder-mask
• 35-70 µm copper traces
• 50-150 µm thermally conductive but electrically insulating dielectric
• 1–3 mm aluminum (or copper) base-plate
  (double-side or multilayer MCPCB are also possible, but single-side is >90 % of the market)

3.Thermal performance: dielectric thermal conductivity 1–10 W/m·K (vs ~0.3 W/m·K for FR-4); junction-to-ambient thermal resistance can drop by 50-80 %.

4. Machining: can be punched, milled, drilled, V-scored like FR-4, but carbide tools and higher spindle speeds are used for aluminum.

5. Applications: high-power LED modules, street-light COB arrays, automotive headlights, power converters, motor drives, solid-state relays, photovoltaic inverters.

♦ Technical Parameters

DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production.

Our products include single, double, multi, high frequency, aluminum base, copper base, FR-4 and other high precision circuit boards.

We have over 10 years of experience in serving many domestic and foreign brand customers in a wide range of fields such as Medical, Automotive, Industrial Automation, Artificial Intelligence, Smart Home, Security, Power and Communications, etc..