2.0mm Inverter Multilayer HDI PCB Board Assembly With Green Solder Mask
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Supply Ability:200,000+ m² PCB per Month
Layer:10 layers
Material:Fr4
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HDI PCB Board for Inverter with Green Solder Mask
♦ What is Solder Mask?
Solder Mask (also called solder resist or solder stop mask) is a thin, protective layer of polymer applied to the copper traces of a printed circuit board (PCB) to prevent oxidation, short circuits, and unintended solder connections during assembly.
Key Characteristics:
- Prevents Solder Bridging
- Covers exposed copper traces to avoid accidental solder connections between pads or traces.
- Protects Copper from Oxidation
- Shields copper from moisture, dust, and environmental damage.
- Improves Electrical Insulation
- Acts as a dielectric barrier to prevent electrical shorts.
- Enhances PCB Durability
- Resists scratches, chemicals, and mechanical stress.
- Aesthetic & Identification
- Typically green (but available in other colors) with silkscreen markings for component placement.
- Prevents Solder Bridging
♦ Types of Solder Mask?
| Type | Description | Common Uses |
|---|---|---|
| Liquid Photoimageable (LPI) | Applied as a liquid, exposed to UV light, and developed (most common). | Standard PCBs, high-precision designs. |
| Dry Film Solder Mask | Pre-formed film laminated onto the PCB, then UV-exposed and etched. | High-density PCBs (HDI). |
| Top & Bottom Side Masks | Applied only to specific sides (e.g., single-sided PCBs). | Simple boards with limited layers. |
| Peelable Solder Mask | Temporary mask that can be removed after soldering. | Selective protection during assembly. |
♦ Types of Solder Mask?
| Feature | Solder Mask Covered | Exposed Copper (No Mask) | Solder Mask Defined (SMD) Pads | Non-Solder Mask Defined (NSMD) Pads |
|---|---|---|---|---|
| Protection | Yes | No | Partial (mask covers edges) | No (pad extends beyond mask) |
| Solderability | Prevents solder spreading | Solder adheres fully | Controlled solder flow | More solder volume |
| Common Use | General traces | Test points, ground pads | Fine-pitch components (BGAs, QFNs) | High-reliability soldering |
♦ Technical Parameters
Item | Spec |
Layers | 1~64 |
Board Thickness | 0.1mm-10 mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size | 800mm×1200mm |
Min Hole Size | 0.075mm |
Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance | 士0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 17um--175um |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 17:01 |
Solder Mask Type | LPI |
SMT Min. Solder Mask Width | 0.075mm |
Min. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
2.0mm Inverter Multilayer HDI PCB Board Assembly With Green Solder Mask
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