Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

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Supply Ability:200,000+ m² PCB per Month
Layer:16 layers
Material:Fr4
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16 Layer Immersion Gold HDI PCB for Electronic Product


♦ What is Immersion Gold?


​​Immersion Gold​​ (also known as ​​ENIG – Electroless Nickel Immersion Gold​​) is a ​​surface finish​​ applied to ​​printed circuit boards (PCBs)​​ to protect exposed copper pads and ensure reliable solder connections. It consists of two layers:

    1. ​​Electroless Nickel (Ni)​​ – A thin (3–6µm) nickel-phosphorus layer deposited chemically (without electricity) to act as a barrier, preventing copper diffusion.
    2. ​​Immersion Gold (Au)​​ – A very thin (0.05–0.1µm) gold layer plated over the nickel to prevent oxidation and enhance solderability.


♦ ​​Key Characteristics of Immersion Gold (ENIG):


✔ ​​Flat Surface​​ – Ideal for fine-pitch components (e.g., BGAs, QFNs).
✔ ​​Excellent Solderability​​ – Ensures strong, reliable solder joints.
✔ ​​Long Shelf Life​​ – Resists oxidation better than bare copper or OSP.
✔ ​​Wire-Bondable​​ – Suitable for gold or aluminum wire bonding (used in IC packaging).
✔ ​​Lead-Free & RoHS Compliant​​ – Environmentally friendly compared to HASL (lead-based).


♦ Comparison with Other PCB Finishes?​


FinishThicknessFlatnessSolderabilityCostBest For
​ENIG​​ (Immersion Gold)Thin Au (0.05–0.1µm)Very FlatExcellentModerateHigh-reliability, fine-pitch
​HASL​​ (Hot Air Solder Leveling)Thick Sn/Pb or SnUnevenGoodLowGeneral-purpose PCBs
​OSP​​ (Organic Solderability Preservative)Organic coatingFlatGood (but degrades over time)LowShort-life consumer electronics
​Electrolytic Hard Gold​Thick Au (0.5–1.5µm)FlatGood (but requires nickel underlayer)HighConnectors, wear-resistant parts

Technical Parameters


Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm


One-Stop PCBs Solution

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

China Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product supplier

Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

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