Micro Blind Buried Via Wireless Charger Circuit Board HDI High Speed PCB

Minimum Order Quantity:1
Payment Terms:T/T
Price:Inquiry Us
Supply Ability:200,000+ m² PCB per Month
Layer:6 Layer
Material:Fr4
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Location: Shenzhen China
Address: Yasen Industrial Park, Baolong Street, Longgang District, Shenzhen
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Micro Blind Buried Via HDI PCB High Speed PCB Medical Imaging Equipment


♦ What is HDI PCB?


HDI PCB uses micro blind/buried vias and build-up technology to create high-density circuits. It forms micron-level interlayer connections via laser drilling and electrochemical plating, eliminating reliance on traditional through-holes. Basic versions have single-layer structures, while advanced variants stack multiple layers with technologies like stacked vias and laser direct imaging to boost density and performance.



Characteristics of HDI PCB

    • High Circuit Density​​ – Smaller traces and spaces allow more components per unit area.

    • ​​Microvias (Blind/Buried Vias)​​ – Laser-drilled microvias enable dense interconnections without traditional through-holes.

    • ​​Fine Pitch Components​​ – Supports tiny packages like BGA, QFN, and 0.4mm pitch ICs.

    • ​​Multi-Layer Stacking​​ – Advanced builds (4+ layers or more) with stacked vias for higher performance.


Applications of HDI PCB


    • Medical field: used in pacemakers, CT scanners, medical imaging equipment, etc., to meet the requirements of equipment miniaturization, high performance and high reliability. For example, the utilization rate of HDI PCB in high-end medical equipment exceeds 70%.

    • Aerospace: used in aircraft avionics systems, satellite communications, navigation systems, etc., to meet the high performance and high reliability requirements of equipment in extreme environments. For example, the aircraft autopilot system uses HDI PCB to ensure flight safety.

    • Industrial control: used in programmable logic controllers (PLCs), industrial robot control systems, etc., to adapt to complex industrial environments and ensure precise control of industrial production.


Technical Parameters


Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm


One-Stop PCBs Solution

PCB PrototypeFelx PCBRigid-Flex PCBCeramic PCB
Heavy Copper PCBHDI PCBHigh Frequency PCBHigh TG PCB

Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry;
    • Perfect after-sales service system;
    • From prototype to mass production

China Micro Blind Buried Via Wireless Charger Circuit Board HDI High Speed PCB supplier

Micro Blind Buried Via Wireless Charger Circuit Board HDI High Speed PCB

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