Product Details
8-layer ENIG HDI PCB High Component Density For 5G Communication
Equipment
♦ What is HDI PCB?
HDI (High Density Interconnect) PCB is a high-density circuit board
constructed by micro blind buried via technology, and uses a
build-up process to achieve three-dimensional interconnection of
inner and outer layer circuits. The core of its manufacturing lies
in the use of laser drilling and electrochemical hole filling
processes to form micron-level conductive paths between layers, so
that each layer of circuit can be vertically connected without
relying on traditional through holes. Ordinary HDI uses a
single-layer structure, while high-end products are stacked through
multiple layers, combined with advanced technologies such as
stacked holes and laser direct forming, to further improve circuit
density and electrical performance.
♦ Characteristics of HDI PCB
- High circuit density
- Miniaturization and thinness
- Excellent signal integrity
- Good heat dissipation performance
- High reliability
- A variety of laminate structures are available
♦ Applications of HDI PCB
- Consumer electronics: used in smartphones, tablets, smart watches,
etc. to achieve thinness and high performance of devices. For
example, a mobile phone motherboard adopts HDI design to reduce
size, improve performance and stability.
- Communication field: It is a key component of 5G base stations,
satellite communications, optical fiber communications and other
equipment to ensure high-speed and stable signal transmission. For
example, NVIDIA's GB200NVL72 system achieves a transmission rate of
1800Gbps.
- Automotive field: used for autonomous driving, in-car
entertainment, body control, power systems, etc., to meet the
complex environment requirements of automotive electronics and
improve automotive intelligence and safety. For example, automotive
electronic modules need to be resistant to high temperatures and
shockproof, which can be met by HDI PCB.
♦ Technical Parameters
Item | Spec |
Layers | 1~64 |
Board Thickness | 0.1mm-10 mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size | 800mm×1200mm |
Min Hole Size | 0.075mm |
Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance | 士0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 17um--175um |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 17:01 |
Solder Mask Type | LPI |
SMT Min. Solder Mask Width | 0.075mm |
Min. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Company Profile
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB
Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and
Testing. We are a one-stop EMS electronic manufacturing company
committed to providing global customers with rapid prototyping and
mass production.
Our products include single, double, multi, high frequency,
aluminum base, copper base, FR-4 and other high precision circuit
boards.
We have over 10 years of experience in serving many domestic and
foreign brand customers in a wide range of fields such as Medical,
Automotive, Industrial Automation, Artificial Intelligence, Smart
Home, Security, Power and Communications, etc..
