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Dual-Valve Vision Dispensing Machine for Underfill & Coating in FPC Modules
In the consumer electronics industry, FPC modules require extremely
precise and stable dispensing processes for Underfill (bottom
filling) and Conformal Coating. The Mingseal FS600DD Series
Dual-Head Vision Inline Dispensing Machine is specially designed
for high-efficiency, high-yield mass production and is widely used
in MiniLED packaging, LED modules, FPC reinforcement, and protective
coating — all of which are key processes in consumer electronics
manufacturing.
This equipment has been successfully deployed in Southeast Asian
markets such as Malaysia, India, and South Korea, helping local
factories significantly improve production line throughput and
product yield.
● Dual-head dual-valve parallel dispensing — Flexible switch between synchronous or independent operation modes
● ±10μm repeatability — Guarantees precise dispensing positions for Underfill and
Coating, greatly improving finished product yield.
● 0.1mg high-precision weighing — Real-time monitoring of dispensing weight eliminates overflow or
missing glue issues and supports various high- or low-viscosity
adhesives.
● Compact structure for dense panel loading — Small footprint, auto-adjustable track height and width, ideal
for high-density shadow board applications.
● Supports dual-track and bottom heating — Ensures stable fluidity and curing conditions for multiple
processes like Underfill, Coating, and PCB Assembly.
FS600DDF Visual Inline Dispensing Machine | ||
Occupied Area | Dimensions (W*D*H) | 770*1200*2000mm |
Clearness Level | Clearness of workspace | Class 1000 |
Motion System | Dispensing Range (W*D) | 320*400mm (Dual-valve) |
Repeatability (3sigma) | X1/X2/YY1: ±10μm | |
Positioning Accuracy (3sigma) | X1/X2/Y/Y1: ±15μm Z1/Z2: ±10μm | |
Max. Speed | X1/X2/Y/Y1: 1300mm/s | |
Max. Acceleration | X1/X2/Y/Y1: 1.3g Z1/Z2: 0.5g | |
Transmission Track | Number of Tracks | Single / Double track (Optional) |
Width Adjustment Method | Auto width adjustment | |
Width Adjustment Range | 50~450mm | |
Max. Convey Speed | 300mm/s | |
Max. Carrier Plate Thickness | 10mm | |
Loadable Board Size (Bottom-mounted) | 10mm | |
Loadable Board Size (Top-mounted) | 10mm | |
Visual System | Camera Pixels | 130W |
Recognition Accuracy | Pixel resolution ≤ 8 μm/pixel | |
Light Source | Circular combination+Coaxial red light (Optional) | |
Weighing System | Accuracy | 0.1/0.01mg (Optional) |
Q1: What FPC module processes is the FS600 Series suitable for?
A: Ideal for COF/COB chip Underfill, camera module flex Underfill,
protective coating, local reinforcement, and sealing applications.
Q2: What advantages does the dual-head dual-valve design have over
single-head?
A: Dual heads can work synchronously or independently, supporting
different adhesives and valves simultaneously, greatly boosting UPH
and process flexibility.
Q3: How does the machine ensure dispensing consistency?
A: High-resolution vision system + real-time weighing + closed-loop
control ensures each glue point is uniform and accurate.
Q4: Can it integrate with existing SMT lines?
A: Yes — dual-track option, auto width adjustment, and SMEMA
interface make it easy to connect with existing SMT production
lines.