4 Layer Green Oil OSP Rigid Flex PCB Customized Board for Electronic devices
Brand Name:xingqiang
Certification:ROHS, CE
Model Number:Varies by goods condition
Minimum Order Quantity:Sample,1 pc(5 square meters)
Delivery Time:15-16 work days
Payment Terms:,T/T,Western Union
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Location:
Dongguan Guangdong China
Address:
Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
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within 29 hours
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Product Details
4-layer OSP soft and hard combination board PCB
The 4-Layer OSP Rigid-Flex PCB is an innovative solution for mid-to-high-end electronics, balancing complex circuit needs and flexible assembly with a precision layered structure, OSP protection, and rigid-flex adaptability: its 4-layer design (50%+ more wiring space than 2-layer) integrates sensors and processors via precise lamination; the FR-4 rigid part ensures stability while the PI flexible part (-40℃ to 125℃) bends to R=0.8mm for 3D spaces, reducing connectors; the thin (0.1-0.3μm) OSP coating prevents copper oxidation (12+ month storage) and enables reliable soldering of 0402/0201 components, with benefits including strong signal integrity (independent ground/power layers cutting EMI/RFI, 30% less loss than 2-layer for <1GHz signals), durability (rigid part resisting 1000G impacts, flexible part enduring 100,000+ bends at R=1mm, working in 95% humidity and dusty environments), and cost-effectiveness (40% less material and 20% shorter production time than 6+ layer boards, with faster OSP than immersion gold), fitting smart wearables, automotive systems, and industrial IoT sensors to solve performance vs. space challenges.
Advantages of Rigid-Flex PCB:
- Support higher complexity circuits
- Optimize signal integrity
- Soft and hard combination of spatial adaptability
- Structural strength and stability
Basic Process Overview
The overall flow includes:
- Material preparation: Selecting flexible substrates (e.g., polyimide) and rigid materials (e.g., FR-4)
- Layer processing: Creating inner layer patterns, drilling, and plating
- Lamination: Combining FPC and PCB layers through thermal pressing
- Final processing: Drilling, surface treatment, and quality control
Product Features:
- The 4-layer structure provides more routing space, allowing for the separation design of power, ground, and signal layers, which can meet the routing requirements of circuits of medium and small sizes (such as electronic devices containing multiple modules interaction), and is more suitable for products with higher functional integration than 2-layer boards
- Independent ground and power planes can reduce signal interference (such as EMI, RFI), lower signal transmission loss, and improve the stability of high- or sensitive signal transmission, suitable for scenarios with high requirements for signal quality (such as communication modules, sensor circuits).
- The bending and folding characteristics of the flexible parts are retained, and it can be assembled in three dimensions in narrow or irregular spaces (such as wiring inside drones, wearable devices), while the four-layer structure can carry more functions within a limited volume, balancing space constraints and performance requirements.
- The laminated structure of the 4-layer board enhances the mechanical strength of the overall rigid part, with better impact and vibration resistance than the 2- board; the flexible part uses polyimide and other substrates, which not only has high temperature resistance (-40℃ to 125℃ common range) but also has chemical resistance, adapting to complex working environments.
- The organic protective film formed by OSP is uniform and thin, which can effectively prevent the oxidation of the copper surface, ensure the good wetting of theer with the copper surface during welding, reduce the problems of false soldering, bridging, etc., improve the reliability of the solder joint, and is especially suitable for welding of precision components.
4 Layer Green Oil OSP Rigid Flex PCB Customized Board for Electronic devices
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