Product Details
1.6-layer HDI thick copper board PCB
HDI PCB, short for High-Density Interconnect Printed Circuit Board, is a high-precision circuit board that adopts microvias (blind
vias, buried vias, stacked vias, etc.), fine conductors (usually
line width/space ≤ 4mil/4mil) and advanced lamination technology.
Its core feature is to achieve higher circuit density and component
integration within a limited board space, which can meet the
development needs of electronic devices for "miniaturization,
lightweight, and high performance". It is widely used in fields
such as 5G communications, medical imaging, smart wearables,
automotive electronics, and aerospace. Compared with traditional
PCBs, HDI PCBs can significantly reduce the board size (usually by
25%-40%) by reducing the diameter of vias and optimizing the
interlayer connection method, while improving signal transmission
speed and stability, and reducing electromagnetic interference.
2.Product Features:
- High-density interconnection
- Micro via
- Blind and buried hole design
- Multi-level design
- Fine lines and fine pitch
- Excellent electrical performance
- Highly integrated
3.Industry-Specific Applications (Help Buyers "See Their Use Case")
- 5G & Telecommunications: 5G small cells, base station transceivers, and optical
modules—handles high-frequency signals (sub-6GHz/mmWave) without
interference.
- Medical Equipment: MRI scanners, portable ECG monitors, and dental imaging
devices—medical-grade materials ensure biocompatibility and
compliance with ISO 13485.
- Automotive Electronics: ADAS (Advanced Driver Assistance Systems), in-vehicle
infotainment, and EV battery management—resists vibration
(10-2000Hz) and humidity (85℃/85%RH, 1000h).
- Aerospace & Defense: UAV (drone) flight controllers, satellite communication
modules—meets MIL-STD-202G for shock, temperature, and altitude
resistance.
4. Material & Reliability (Meet Global Industry Standards)
| Material/Standard | Specification | Advantage for Global Buyers |
|---|
| Base Substrate | FR-4 (Tg 170-220℃) / High-Tg PI (for high-temperature scenarios) | Withstands -55℃~150℃ operating temperature; compatible with
lead-free soldering (260℃ peak) |
| Copper Foil | 0.5oz~3oz (electrodeposited/rolled) | Ensures low resistance (≤0.003Ω/sq) for high-current applications
(e.g., automotive power modules) |
| Surface Finish | ENIG (Immersion Gold: 3-5μm Au) / OSP / HASL | ENIG provides 1000+ contact cycles (ideal for connectors);OSP suits
low-cost, high-volume consumer electronics |
Company Profile
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that
manufactures single-sided and double-sided PCBs, multi-layer PCBs,
and Rigid Flex PCBs.
As a professional supplier of customized boards, we work closely
with our clients, leveraging our strengths in processes and
technologies based on their design files to create
high-performance, high-quality customized boards that support their
product innovation and upgrades.Our company has two production
bases in Dongguan andJiangxi, covering an area of 205000 square
meters with a comprehensive monthly production capacity of 200000
square meters. The company's products are widely used in computer
peripherals, communication, power supply, medical, automotive
electronics, household appliances and other fields.
Our company advocate integrity, win-win and pioneering business
philosophy, and put into practice the work style of "pragmatism,
hard work and responsibility" to create a good corporate
environment. Based on a new management model, advanced technology
and equipment and good product quality, We always adhere to the
corporate spirit of customer first and people-oriented.