Gold Plating Process Double Sided PCB FR4 Material OSP Process Customized Service

Double-sided gold plating PCB

This type of PCB has a double-sided copper design, with conductive patterns on both sides of the insulating substrate. The gold plating is applied through an electroplating process, providing excellent wear resistance and strong anti-oxidation properties, making it suitable for high-reliability electronic devices. The manufacturing process involves key steps such as cutting, drilling, copper deposition, pattern electroplating, and gold plating, where the gold layer is deposited on the copper foil through a catalytic electroplating process.

Advantages of Double-sided PCB:

• Increase the wiring space
• Improve the circuit functional density
• The cost is relatively low
• Good electrical performance
• Adapt to high integration requirements

Applications:

• Communication equipment

• Automotive electronics

• Other fields

• Computer peripherals

• Medical devices

• Industrial systems

Key Features of Double-Sided PCBs:

1. Dual Copper Layers: Conductive copper traces exist on both sides (top & bottom) of the insulating substrate (e.g., FR-4).
2. Plated Through-Holes (PTHs): Essential metalized holes electrically connect circuits between the two layers, enabling vertical routing.
3. Increased Density & Complexity: Supports significantly more components and traces than single-sided boards by utilizing both surfaces and cross-layer connections via PTHs.
4. Design Flexibility: Offers greater routing freedom for complex circuits, overcoming the limitations of single-layer designs.
5. Component Mounting: Accommodates both SMD (Surface Mount) and through-hole components on either or both sides of the board.
6. Standard Finishes: Typically includes solder mask (insulation/protection) and silkscreen (markings) applied to one or both sides.

Manufacturing process:

→ Copper Cladding (double-sided copper foil on insulating substrate)

→ Drilling (creating holes for interconnections)

→ Plating (electroplating copper to strengthen hole walls)

→ Imaging (transferring circuit patterns to both sides)

→ Etching (removing excess copper to form conductive traces)

→ Solder Mask Application (adding protective coating)

→ Surface Finish (e.g., gold plating for durability) → Silk Screening (adding component labels) → Electrical Testing (verifying conductivity and connections) → Final Inspection and Packaging.

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.

As a professional supplier of customized boards, we work closely with our clients, leveraging our strengths in processes and technologies based on their design files to create high-performance, high-quality customized boards that support their product innovation and upgrades.Our company has two production bases in Dongguan andJiangxi, covering an area of 205000 square meters with a comprehensive monthly production capacity of 200000 square meters. The company's products are widely used in computer peripherals, communication, power supply, medical, automotive electronics, household appliances and other fields.

Our company advocate integrity, win-win and pioneering business philosophy, and put into practice the work style of "pragmatism, hard work and responsibility" to create a good corporate environment. Based on a new management model, advanced technology and equipment and good product quality, We always adhere to the corporate spirit of customer first and people-oriented.