Product Details
FR4 solder-masked 6-layer board PCB
A 6-layer FR4 solder mask PCB is a multilayer printed circuit board (PCB) based on an FR4
substrate and including its solder mask layer. Designed for complex
electronic designs, this PCB consists of six layers, typically
consisting of an outer copper foil layer, an inner signal layer, an
inner copper foil layer, and a substrate layer. FR4 acts as an
insulating core material, providing mechanical strength and
electrical performance. A solder mask (usually green) covers the
copper layer to prevent short circuits and oxidation, leaving only
the solder pads for soldering.
Advantages of Multilayer PCB:
| Feature | Description |
| Structure | Typically consists of 6 layers: outer copper layers, inner
signal/power layers, and FR4 dielectric layers, with a solder mask
on top and bottom. |
| Solder Mask | The solder mask (usually green) covers the copper traces,
protecting against oxidation, short circuits, and environmental
damage. |
| High Density | Supports complex circuitry and dense component layouts due to
multiple layers. |
| Signal Integrity | Offers good signal integrity and reduced electromagnetic
interference (EMI) thanks to inner layer shielding and controlled
impedance design. |
| Mechanical Strength | FR4 material provides high mechanical strength and dimensional
stability. |
| Application | Commonly used in complex electronic devices such as computers,
industrial controls, and communication equipment. |
| Cost & Complexity | Higher manufacturing cost and design complexity compared to simpler
boards. |
Product Features:
- Multi-layer design
- Inner layer and outer layer
- through hole
- Copper layer
- Dielectric layer (dielectric material)
Manufacturing process:
- Design and layout: During the design phase, engineers use PCB design software to lay
out and route multilayer circuit boards, determining the functions
of each's circuit and the interconnection method between layers.
- Lamination: During the manufacturing process, multiple circuit layers are
pressed together through a lamination process, with each layer
separated by an insulating material. lamination process is
typically carried out under high temperature and high pressure
conditions.
- Drilling and electroplating: Through-hole connections between different layers of the circuit
are formed by drilling technology, and then electroplating is
carried out ensure the conductivity of the through-holes.
- Etching: On each layer of the circuit, use photolithography and etching
techniques to form the circuit pattern, removing excess copper foil
- Assembly and welding: After the components are installed, they can be soldered and
connected using surface-mount technology (SMT) or traditional
through-hole technologyTHT).
Company Profile
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that
manufactures single-sided and double-sided PCBs, multi-layer PCBs,
and Rigid Flex PCBs.
As a professional supplier of customized boards, we work closely
with our clients, leveraging our strengths in processes and
technologies based on their design files to create
high-performance, high-quality customized boards that support their
product innovation and upgrades.Our company has two production
bases in Dongguan andJiangxi, covering an area of 205000 square
meters with a comprehensive monthly production capacity of 200000
square meters. The company's products are widely used in computer
peripherals, communication, power supply, medical, automotive
electronics, household appliances and other fields.
Our company advocate integrity, win-win and pioneering business
philosophy, and put into practice the work style of "pragmatism,
hard work and responsibility" to create a good corporate
environment. Based on a new management model, advanced technology
and equipment and good product quality, We always adhere to the
corporate spirit of customer first and people-oriented.