Lntech SNQ-3578C Stacked 30mm Camera Module Board 1080p60 Network Camera Module

The Lntech SNQ-3578C represents a significant departure from conventional camera module design, emphasizing three-dimensional integration and signal integrity. It utilizes a stacked architecture of two 30mm diameter circular printed circuit boards (PCBs). This design physically separates the image sensor and associated analog circuitry on one board from the main digital processor and I/O connectors on the other, interconnected via precision board-to-board connectors. It is built around a 1/1.8-inch Sony IMX385 STARVIS™ CMOS sensor, chosen for its exceptional sensitivity and image quality, capable of outputting 1080p video at 60 frames per second. This module is intended for advanced OEMs and integrators in the scientific, industrial, and high-end security markets.

1. Stacked PCB Architecture & Advantages
The dual-layer stacked circular design is the module's defining characteristic, offering several engineering benefits:

• Improved Signal Integrity: By separating noise-generating digital components from the sensitive analog sensor, the design minimizes digital noise coupling into the analog signal path, directly contributing to a cleaner image output.

• Reduced Electromagnetic Interference (EMI): The physical separation allows for more effective shielding strategies between board layers.

• Volumetric Efficiency: While the diameter is fixed at 30mm, the stacked approach allows for a more efficient use of the Z-axis (height) within a product, potentially leading to a smaller overall product volume compared to a large single board.

2. Optical Performance: The 1/1.8-inch Format
The Sony IMX385 sensor's 1/1.8-inch optical format is a key performance differentiator. This larger size, compared to common 1/2.8" sensors, provides:

• Enhanced Low-Light Response: The larger pixel size (3.75µm) fundamentally improves photon capture ability, which is the primary factor in achieving superior low-light performance.

• Increased Dynamic Range: The larger photodiode capacity allows for a wider intra-scene dynamic range.

• Optical Design Flexibility: The larger sensor may require lenses designed to cover a 1/1.8-inch format, which can offer different optical characteristics.

3. Integration Considerations for OEMs
Integrators must be aware of the specific requirements of this design:

• Custom Housing Mandatory: The unique stacked circular form factor necessitates a completely custom housing design. Detailed mechanical drawings are essential.

• Connector Interface: The interconnection between the two boards is critical. The design uses reliable board-to-board connectors, but the overall assembly process must be precise.

• Thermal Management: The compact, stacked design may influence heat dissipation; ensuring adequate thermal pathways in the final housing is recommended.