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The injection molding process enables rapid production of precision electronic components, such as CPU fan mounts. Melt injection and cooling to solidify the mold ensure product accuracy and stability.
| Parameter | Value Range/Description |
|---|---|
| Material | ABS, PC, PA66 |
| Injection Pressure | 70–190 MPa |
| Mold Steel | H13, S136, 718 |
| Mold Life | 100,000–600,000 cycles |
| Product Dimensions | 5–120 mm |
| Wall Thickness | 0.6–4 mm |
| Accuracy | ±0.02 mm |
| Surface Treatment | Sandblasting, Texturing |
| Molding Cycle Time | 10–70 seconds |
| Applications | CPU fan mounts, motherboard accessories |
CPU heat sink mounts, electronic mounting components
We offer specialized molds for computer cooling components, supporting customized designs and mass production.