FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication

Brand Name:HighLeap
Certification:ISO9001/Iso14001/CE/ROHS
Model Number:PCB Board
Minimum Order Quantity:1pcs
Delivery Time:1-15 working days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Active Member
Location: Guangzhou China
Address: Room 1306, building 2, No. 96, Lixin 12 road, Xintang Town, Zengcheng District, Guangzhou
Supplier`s last login times: within 42 hours
Product Details Company Profile
Product Details

Multilayer PCB
Special Tech
Place of Origin:
China
1.Impedance

2.Via Filling

3.PFH,Backdrill

4.Mix Finishes

5.Cave

6.Heatsink

7.ENEPIG
Brand Name:
Highleap
Application Segment:
Auto,Industrial,Medical,DataCom,Consumer
Layer Count:
4~50L
Matierial:
FR4 (Tg130~Tg170)
Board Thickness(mm):
0.6mm~10.0mm
Copper Thickness(oz):
Hoz~3oz
Size(mm):
5mm~1200mm
Min. LW/LS(mm):
0.1/0.1
Min. Hole(mm):
0.25
Solder Mask:
Green, Yellow, Blue, Black, White...
Surface Finish:
ENIG,OSP,HASL,Imm Tin,Imm Silver...
Certificate:
RoHS/ISO9001/ISO14001
Service:
OEM
About HighLeap Electronic
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China FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication supplier

FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication

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