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1-20 Layers FPC /flex/rigid/rigid flex pcb circuit board manufacturer
PROCESS | Item | Unit | Limit Tolerance | Normal tolerance |
Board cutting & thickness | Layer | / | 1-6 layer | 1-6 layer |
/ | 2-layer(rigid flex) | 2-layer(rigid flex) | ||
cutting size: 250mm | mm | 250*1000mm | 250*500mm | |
Min. thickness | mm | 0.075mm(FPC) | 0.10mm(FPC) | |
mm | 0.3mm(rigid flex) | 0.3mm(rigid flex) | ||
Other auxiliary material | Adhesive stiffener | um | PSA:50um | PSA:50um |
hot setting adhesive | um | 12.5/25/40um | 12.5/25/40um | |
PI stiffener | um | PI: 1.0-13mil | PI: 1.0-13mil | |
Other stiffener type | / | steel, Al, silicon steel sheet | ||
Drilling | Min. drilling hole size | mm | 0.1 | 0.2 |
hole diameter tolerance | mm | ±0.075 | ±0.1 | |
PTH | hole wall copper thickness | um | 8/15/25 | 8/15/25 |
Exposure | Min line width/space | mm | 0.05/0.05 | 0.075/0.075 |
hole ring | mm | 0.125 | 0.2 | |
offset tolerance | mm | 0.1 | 0.15 | |
Line width tolerance | mm | ±0.03 | ±0.04 | |
Distance between hole edge to outline | mm | ≥0.4 | ≥0.5 | |
Lamination | Coverlay tolerance | mm | 0.15 | 0.2 |
PI stiffener with outline | mm | ±0.3 | ±0.3 | |
Sensitive PSA | mm | ±0.3 | ±0.3 | |
FR4 location tolerance | mm | ±0.3 | ±0.3 | |
Ink | Soler mask thickness | um | 8 | 15 |
Silk screen thickness | um | 8 | 15 | |
Profile | R angle for etching cutting die | mm | 0.5 | 0.5 |
mm | LS: ±0.075 | LS: ±0.075 | ||
Steel die tol. | mm | HS: ±0.01 | HS: ±0.01 | |
mm | Etching: ± 0.20 | Etching: ± 0.30 | ||
Cutting die tol. | mm | Wooden: ± 0.30 | Wooden: ± 0.50 | |
Laser tol. | mm | ± 0.05 | ± 0.05 | |
Offset tol. for fingers | mm | ± 0.10 | ± 0.10 | |
Surface treatment | um | Ni: 2.0~5.0 | Ni: 2.0~5.0 | |
Immersion gold | um | Au: 0.03~0.08 | Au: 0.03~0.08 | |
Plating tin | um | 8~20 | 8~20 |
Q1.What file you need to prepare if you want to get an quotation
from us?
For PCB board, you need to prepare files of Gerber file,it should
including RS-274X,ODB++, DXF, PCB, PCBDOC etc formats.
For PCBA(PCB with soldered components), except the file for PCB,
you also need to prepare the BOM list (components list), Pick and
Place file(txt format), real sample pictureor 3D PDF version file
etc.
Q2. Do you have any MOQ Limited ?
We havent any limited about MOQ .Sample and mass production all can
support.
Q3. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and
promising tokeep customers data in high confidential level.