TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001
Brand Name:Texas Instruments
Model Number:TLV314QDBVRQ1
Minimum Order Quantity:1 piece
Delivery Time:2~8 workdays
Payment Terms:T/T
Brand:Texas Instruments
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PRODUCT DESCRIPTION
TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1
8542.33.0001
Amplifier IC Chips Texas Instruments/TI TLV314QDBVRQ1
| ECAD Module | PCB Symbol,Footprint & 3D Model |
| Supply and Demand Status | Balance |
| Popularity | High |
| Fake Threat In the Open Market | 45 pct. |
| Quantity per package | 3000 |
| HTSUS | 8542.33.0001 |
| ECCN | EAR99 |
| REACH Status | REACH Unaffected |
| MSL Level | 2 (1 Year) |
| Case / Package | SOT-23-5 |
| Package | SC-74A, SOT-753 |
| Mounting | Surface Mount |
| Operating Temperature Range | -40°C ~ 125°C |
| Package | Reel - TR |
| Series | Automotive, AEC-Q100 |
| Manufacturer | Texas Instruments |
| Family Name | TLV314 |
| Estimated Pruduction Lead Time | 34 Weeks |
| Categories | Integrated Circuits (ICs) |
| Other Part Number | -296-45322-1-ND, 296-45322-6, TLV314QDBVRQ1-ND, 296-45322-1, 296-45322-2 |
| Win Source Part Number | 936880-TLV314QDBVRQ1 |
| Features | CMOS Amplifier Circuit Rail-to-Rail SOT-23-5 |
Features for the TLV314-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to +125°C AmbientOperating Temperature Range
- Device HBM ESD Classification Level 3A
- Device CDM ESD Classification LevelC6
- Low Offset Voltage: 0.75 mV (Typical)
- Low Input Bias Current: 1 pA (Typical)
- Wide Supply Range: 1.8 V to 5.5 V
- Rail-to-Rail Input and Output
- Gain Bandwidth: 3 MHz
- Low IQ: 250 µA/Ch (Maximum)
- Low Noise: 16 nV/√Hz at 1 kHz
- Internal RF and EMI Filter
- Number of Channels:
- TLV314-Q1: 1
- TLV2314-Q1: 2
- TLV4314-Q1: 4
- Extended Temperature Range:
–40°C to +125°C
Description for the TLV314-Q1
The TLVx314-Q1 family of single-, dual-, and quad-channel operational amplifiersrepresents a new generation of low-power, general-purpose operational amplifiers. Rail-to-railinput and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a widebandwidth of 3 MHz to make this family very attractive for a variety of battery-poweredapplications that require a good balance between cost and performance. The TLVx314-Q1 familyachieves a low-input bias current of 1 pA, making it an excellent choice for high impedancesensors.
The robust design of the TLVx314-Q1 devices provides ease-of-use to the circuit designer:unity-gain stability, RRIO, capacitive loads of up to 300-pF, an integrated RF and EMI rejectionfilter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD)protection (4-kV HBM).
These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to+125°C.
The TLV314-Q1 (single) is available in both 5-pin SC70 and SOT-23 packages. TheTLV2314-Q1 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314-Q1 isoffered in a 14-pin TSSOP package.
TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001
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