Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

Brand Name:WANLI-ADHESION
Certification:ISO9001 ISO14001 IATF16949
Model Number:PUR-XBB768
Minimum Order Quantity:20 KG
Delivery Time:5-8 work days
Payment Terms:L/C, T/T
Contact Now

Add to Cart

Verified Supplier
Location: Wuxi Jiangsu China
Address: Changjiang South Road, No.17-17, Wuxi, Jiangsu 214000, CN
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufacture.


Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.

APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.

Application MaterialWoodworking Edgebanding Hot Melt Adhesives
AppearanceIvory White Solid
ComponentPUR (Polyurethane)
Application IndustryWoodworking Edgebanding
Solid Content100%
Operating Temperature120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt ViscosityAbout 55000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time8~15s@25℃
Usage ScopeEdge Bonding of Wood Materials - Chip Board
Shelf Life6 Months
Package2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel


FEATURE
Very good initial adhesion.
Suitable opening time.
High final bonding strength.

USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.

STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.


China Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 supplier

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

Inquiry Cart 0