XGZP6847A Electronic Pressure Sensor Module 1000kPa DIP Encapsulation

Brand Name:CFsensor
Model Number:XGZP6847A
Minimum Order Quantity:5
Delivery Time:3-5work days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
Place of Origin:CHINA
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Location: Shenzhen Guangdong China
Address: Room 3306AB 33rd Floor, SEG Plaza,Huaqiang North Road, Futian District, Shenzhen Guangdong Province 518028
Supplier`s last login times: within 26 hours
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Product Details

Product Description:

XGZP6847A - 100 kpa ~ 1 kpa... The 1000kPa Pressure Sensor Module Is Used In Medical Equipment


Features:

XGZP6847A type pressure sensor module in the form of class DIP encapsulation, the two side of PCB were fitted with SOP encapsulation of pressure sensor and signal processing circuit chip, offset and sensitivity of sensors, temperature drift and nonlinear digital compensation, power supply voltage as reference, to produce a standard after calibration, temperature compensation, the voltage signal.

XGZP6847A PRESSURE sensor module size is small, easy to install, can be calibrated according to user requirements output signal, widely used in medical electronics, automotive electronics, sports and fitness equipment and other fields.

XGZP6847A can be customized with various pressure ranges and accuracy (up to ±2Pa).

Electronic sphygmomanometer, ventilator, oxygen generator, monitor and other medical fields

Tire pressure gauge, steering power assist, brake power assist, MAP sensor and other automotive electronic fields

Massager, massage chair, air mattress and other sports and fitness equipment field

Water heater, oxygen water machine, beer machine, coffee machine, electric breast pump, vacuum cleaner and other fields

Air pump, vacuum pump, pressure meter and other fields


Specifications:

Measurement mediumair
medium temperature(25±1) ℃
ambient temperature(25±1) ℃
Vibration0.1g(1m/ S2)Max
humidity(50%±10%) RH
power supply(5±0.005) V DC


China XGZP6847A Electronic Pressure Sensor Module 1000kPa DIP Encapsulation supplier

XGZP6847A Electronic Pressure Sensor Module 1000kPa DIP Encapsulation

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