The Invisible Pillar of Power Line Carrier Communication: Redefining High-Voltage Coupling System Architecture Design

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Place of Origin:XIAN, CHINA
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The Invisible Pillar of Power Line Carrier Communication: Redefining High-Voltage Coupling System Architecture Design


Drawing:


Parameters:

No.SpecificationDissipationWithstanding voltageInsulation resistanceDimension(mm)
120kV-2000pF








≦0.0040








1.5Ur 1min








≧1.0×105MΩ

DHLDM
220kV-10000pF451923125
320kV-18000pF651519125
430kV-1000pF801725125
530kV-2700pF452432124
630kV-12000pF602028124
740kV-150pF20334184
840kV-500pF28334184
940kV-7500pF802429126
1040kV-10000pF802226165
1150kV-1000pF503034124
1250kV-1000pF322731165
1350kV-5600pF803135165
1460kV-1500pF503134125
1560kV-3000pF653235165
16100kV-500pF505458125
17100kV-2000pF513235165
18Insulator type 100kV-1500pF683640165
19150kV-820pF6595100125
20200kV-600pF50909416


The Invisible Pillar of Power Line Carrier Communication: Redefining High-Voltage Coupling System Architecture Design

In power line carrier communication system architectures, high-voltage doorknob capacitors are far more than simple passive components; they are crucial to system performance. Traditional design approaches that treat capacitors as standalone components are outdated. Our high-voltage doorknob capacitors, through system-level optimization, redefine the performance boundaries of coupling units.

Modern PLC systems face unprecedented challenges: increased interference caused by spectrum congestion, stringent requirements for real-time data transmission in smart grids, and a deteriorating noise environment brought on by the integration of new energy sources. Our high-voltage doorknob capacitors utilize multilayer composite dielectric technology to achieve precise impedance characteristics in specific frequency bands (such as CENELEC A/B bands or FCC bands), effectively suppressing out-of-band interference. Our patented electric field balancing design addresses the partial discharge problem of traditional capacitors under steep pulses, enabling the system to maintain excellent signal-to-noise ratio in complex power noise environments.

We provide more than just capacitors; we provide complete coupling system solutions. Through electromagnetic-thermal multiphysics co-simulation, we optimize the matching characteristics of the capacitors and the coupled filters, reducing impedance mismatch losses in traditional designs by over 60%. The innovative distributed heat dissipation structure reduces the product's temperature rise by 25°C when running at full load compared to traditional designs, ensuring the long-term stability of the system in high-temperature environments.

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The Invisible Pillar of Power Line Carrier Communication: Redefining High-Voltage Coupling System Architecture Design

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