Mo + 0.40-0.55%Ti + 0.06-0.12%Zr TZM Molybdenum Alloy Disc Tzm Alloy Disc Titanium Zirconium Molybdenum Alloy Disk

Brand Name:PRM
Certification:ISO9001
Model Number:custom
Minimum Order Quantity:1pc
Delivery Time:10~15work days
Payment Terms:T/T
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Location: Baoji Shaanxi China
Address: No.188 Gaoxin Road,Weibin District Baoji City,Shaanxi,China
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Mo + 0.40-0.55%Ti + 0.06-0.12%Zr TZM Molybdenum Alloy Disc


1. Description of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:


TZM molybdenum alloy disc is currently the most excellent molybdenum alloy high temperature material. It is a solid solution hardening and particle reinforced molybdenum-based alloy, TZM is harder than pure molybdenum metal, and has a higher recrystallization temperature and better creep resistance, the recrystallization temperature is about 1400 ℃, much higher For molybdenum, it can provide better solderability.


2. Size of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:


Disc diameter : 20-600mm

Disc thickness: 6-25mm


Surface: black,C.C,bright,polished

Standard: ASTMB 386


Also we can process as per customer's request.



3. Mechanical properties of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:

Elongation
/%
Elastic Modulus
/GPa
Yield Strength
/MPa
Tensile Strength
/MPa
Fracture Toughness
/(MP·m1/2)
<20
320
560~1150
685
5.8~29.6

4. Actual measured chemical composition of TZM Molybdenum Alloy Disc:

ElementSiMnNiCuVZrOPFeMg
Concentration(%)0.0020.00090.00080.00180.0130.0860.320.0010.00110.0015
ElementAlTiCaCN
Concentration(%)0.0010.5<0.0010.0120.0022
Purity(Metallic Base) Mo≥99.06%(TZM)

5. Application of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:

TZM Molybdenum Alloy Disc mainly used for high-temperature furnace components, crucibles, missiles and other rocket nozzle under high temperature.


TZM Molybdenum Alloy Disc are widely used as contact materials in silicon controlled rectifiers diodes, transistors and thyristors (GTO’S). Other than in specialist applications, molybdenum is now accepted as the first choice mounting material for power semiconductor devices due to its significantly lower cost and weight.The fact that both materials have a similar coefficient of expansion to silicon combined with high thermal conductivity makes them an ideal choice, especially in large area power devices where considerable heat is generated. Further applications include the use of molybdenum as heat sink bases in IC’S, LSI’S and hybrid circuits.




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China Mo + 0.40-0.55%Ti + 0.06-0.12%Zr TZM Molybdenum Alloy Disc Tzm Alloy Disc Titanium Zirconium Molybdenum Alloy Disk supplier

Mo + 0.40-0.55%Ti + 0.06-0.12%Zr TZM Molybdenum Alloy Disc Tzm Alloy Disc Titanium Zirconium Molybdenum Alloy Disk

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