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POP Boards High-Reliability PCB Assembly Services Immersion Gold + OSP
PCB Assembly Services Description:
1. Provide high multilayer PCB manufacturing service.
2. 2-68 layers of samples can be provided for mass production.
3. Ordinary board/HDI board/FPC/rigid-flex joint board/metal base
plate.
PCB Assembly Services Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.5-17.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Assembly Services Introduction:
1. High density possible
Over the years, the high density of printed boards has been able to
develop correspondingly with the improvement of integrated circuit
integration and the advancement of mounting technology.
2. High reliability
Through a series of technical means such as inspection, testing and
aging tests, the PCB can be guaranteed to work reliably for a long
time (usually 20 years).