Industrial Embedded Automation Computers IPC Box AGX Orin 275 TOPs
Brand Name:PLINK
Model Number:ORIN64-8F2E1
Minimum Order Quantity:1SET
Delivery Time:15-30 work days
Payment Terms:T/T, D/P, D/A, L/C
Place of Origin:China
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Beijing Beijing China
Address:
C1106,Jinyu Jiahua Building,Shangdi 3rd Street, Haidian District, Beijing 100085, P.R.China
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Product Details
Industrial Embedded Automation Computers IPC Box AGX Orin 275 TOPs
PLINK Self-developed NVIDIA IPC (ORIN64-8F2E1)
NVIDIA Jetson AGX Orin 64G
Up to 275 TOPS (INT8)
Arm Cortex-A78AE CPU
Maximum Module Power: Up to 60 W
64GB 256-bit LPDDR5 DRAM
64GB eMMC 5.1 Flash Storage | Bus Width: 8-bit | Maximum Bus Frequency: 200 MHz (HS400 or HS533)
Unleash the power of an accelerated platform for Automation and AI.
AI and robotics across industries
See PLINK's Isaac platform deployed at the edge for autonomous mobile robotics, industrial automation, healthcare, retail, agriculture, and more.
Simulate and Test
Robots are virtually trained and tested in photorealistic and physically accurate environments using NVIDIA Isaac Sim operating in the NVIDIA Omniverse virtual environment.
Develop Applications
High-performance robotics applications can be developed using hardware-accelerated SDKs such as Isaac ROS GEMs for ROS-based robots, the NVIDIA DeepStream SDK for streaming video understanding, NVIDIA Riva for natural language processing, and the Isaac SDK for a complete framework.
Deploy and Manage
Only NVIDIA offers a complete end-to-end workflow to enable
seamless deployment. Robotics applications can be ported onto
NVIDIA edge devices from NVIDIA Jetson to EGX edge computers to
create truly autonomous machines. Scaling services across
distributed edge cases are also available on EGX Fleet Command.
NVIDIA Jetson AGX Orin 64GB Embedded Computer
Technical Specification
| Color | Black |
Module | NVIDIA Jetson AGX Orin 64G |
AI Performance | 275 TOPS |
| GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| Memory | 64GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 |
Video Encode | 2x 4K60 (H.265) |
Video Decode | 1x 8K30 (H.265) |
| CAN | 2 |
| GPIO | 4 |
| SPI | 1 |
| I2C | 2 |
| RS 232 | 2 |
| 10/100/1000 Ethernet/RJ45 | 2 |
| Debug | 1 |
| Temperature Range | -20~+65°C |
| Power Supply | AC 220V |
| Dimensions | 430 mm × 360 mm × 88mm |
| Weight | 6050g |
Industrial Embedded Automation Computers IPC Box AGX Orin 275 TOPs
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