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10 Layers PCB Quick Turn Printed Circuit Boards Fr4 Material For Airplane

10 Layers PCB Quick Turn Printed Circuit Boards Fr4 Material For Airplane

Brand Name:YScircuit
Certification:ISO9001,UL,REACH, RoHS
Model Number:YS-ML-0005
Minimum Order Quantity:1 piece
Delivery Time:2-8 days
Payment Terms:T/T,PayPal, Alibaba pay
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Location: Shenzhen China
Address: Shenzhen YingSheng Technology Co., Ltd 805, Tongxin Technology Building, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen
Supplier`s last login times: within 34 hours
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10 Layers Pcb Quick Turn Fr4 Print Circuit Boards For Airplane


What is a quick turn PCB?


Getting electronic products to market depends on rapid manufacturing capabilities.

A quick turn PCB is critical during the prototype, pre-production, and full production phases of any product containing a printed circuit board.

Inconsistent timelines can lead to product delays and rushed testing, ultimately resulting in a poorer quality product.


YScircuit offers quick turn PCBs with quality in mind. We look at quick turn PCB manufacturing throughout each stage of the process, and provide realistic timelines for different sizes of orders.


YScircuit Bare Boards Normally Delivery Time
layer/m²S<1㎡S<3㎡S<6㎡S<10㎡S<13㎡S<16㎡S<20㎡S<30㎡S<40㎡S<50㎡S<65㎡S<85㎡S<100㎡
1L4wds6wds7wds7wds9wds9wds10wds10wds10wds12wds14wds15wds16wds
2L4wds6wds9wds9wds11wds12wds13wds13wds15wds15wds15wds15wds18wds
4L6wds8wds12wds12wds14wds14wds14wds14wds15wds20wds25wds25wds28wds
6L7wds9wds13wds13wds17wds18wds20wds22wds24wds25wds26wds28wds30wds
8L9wds12wds15wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
10L10wds13wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
12L10wds15wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
14L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
16L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds

YScircuit PCB Fabrication Fastest Expedite Delivery Time
0-0.5m20.5-1m21-3m23-5m25-10m2
1-2L24H24H3wds4wds5wds
4L24H48H4wds5wds6wds
6L48H48H4wds6wds6wds
8L48H36H5wds6wds

8wds


YScircuit PCB Capabilities

Technical indexMass BatchSmall batchSample
Base MaterialFR4Normal TgShengyi S1141,KB6160(not suitable for lead free process)
Middle TgFor HDI, multi layers: SY S1000H,ITEQIT158.TU-662
High TgFor thick copper, high layer: SY S1000-2;ITEQIT180A;ISOLA:FR408R;370HR;TU-752;
Halogen FreeMiddle Tg:SYS1150G.H160HF;high Tg: SYS1165
High CTICTl≥600 SY S1600
High FrequencyRogers,Arion,Taconic,SY SCGA-500.S7136
High SpeedSYS7439,TU-862HF.TU-872SLK;ISOLA:l-Speed.1-Tera@MT40;
Flex MateriaBaseGlue-free:Dupont AK XingyangW-type,Panosonic RF-775;
CoverlaySY SF305C.Xingyang O-type
Special PPNo flow PP:VT-447LF.Taiguang 370BL Arion 49N
Ceramic filled adhesive sheetRogers4450F
PTFE adhesive sheetArion6700.Taconic FR-27/FR-28
Double-sided coating PExingyang N-1010TF-mb
Metal BaseBerguist Al-base, chaosun Al-base,copperbase
SpecialHigh heat resistance rigidity Pl: TenghuiVT-901.Arion85N.SY S260(Tg250)
High thermal conductivty material: 92ML
Pure ceramic matenal: alumna ceramic.Aluminum nitride ceramics
BT material: Taiwan Nanya NGP-200WT
LayersFR4203648
Rigid8Flex/(Flex)16(6)16(6)24(6)
High Frequency Mixed Lamination121220
100% PTFE6610
HDI4 steps4 steps4 steps
Technical lndexMass BatchSmall BatchSample
Delivery SizeMax(mm)1200*5601200*5601200*560
(mm)Min(mm)20*2010"105*10
Finish board thicknessMax(mm)10
Min(mm)0.3
Width/GapInner(mil)0.5OZ base cooper: 3/3 1.0OZ base copper: 4/42.0OZ base copoer: 516
3.0OZ base cooper: 7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15
6.0OZ basecooper: 12/18 10OZ basecopper: 18/24 12OZ base copper: 20/28
Outer (mil)1/3OZ base copper: 3/3 0.5OZ base copper: 4/4 1.0OZ base copper: 5/5
2.0OZ base cooper: 6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13
5.0OZ base cooper: 10/16 6.0OZ base copper: 12/18 10OZ base copper:18/24
12OZ base copper: 20/28150Z base copper: 24/32
Line Width
Tolerance
>5.0 mil±20%±20%±1.0mil
≤5.0 mil±1.0mil±1.0mil±1.0mil
DrillingMin laser(mm)0.10.10.1
Min CNC(mm)0.20.150.15
Max CNC drill bit (mm)6.56.56.5
Min Half Hole(mm)0.50.40.4
PTH Hole(mm)Normal±0.1±0.075±0.075
Pressing Hole±0.05±0.05±0.05
Hole Angle(conical)Width of upper diameters≤6.5mm:800,900,1000,1100:Width of upper diameters≤65mm:900;
Frecision of Depth-control Drilling (mm)±0.10±0.075±0.05
Number of blind CNC holes of one sidd≤2≤3≤4
Minimum via hole spacing (different network, military, medical, automobile )mm0.50.450.4
Minimum via spacing(different network, general industrial control and consumer electronic ) mm0.40.350.3

What is Multilayer PCBs

Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB.

It features layers more than double sided PCB.

PCB Sideplating

Sideplating is the metalization of the board edge in the PCB filed.

Edge plating, Border plated, plated contour, side metal, these words can also be used to describe the same function.


Half-cut Castellated Holes

Castellations are plated through holes or vias located in the edges of a printed circuit board.

Are indentations created in the form of semi-plated holes on the edges of the PCB boards.

These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.


Parameters

  • Layers: 10L multilayer pcb
  • Board Thinkness:2.0mm
  • Base Material:S1000-2 High tg
  • Min Holes:0.2mm
  • Minimum Line Width/Clearance:0.25mm/0.25mm
  • Minimum Clearance between Inner Layer PTH to Line: 0.2mm
  • Size:250.6mm×180.5mm
  • Aspect Ratio:10 : 1
  • Surface treatment:ENIG+ Selective hard gold
  • Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes
  • Applications: Wi-Fi modules

YScircuit Print Circuit Boards Production Process


PCB Stack UP


FQA


1. What is hard gold in PCB?

The Hard Gold surface finish, also known as Hard Electrolytic Gold, is composed of a layer of gold with added hardeners for increased durability, plated over a barrier coat of nickel using an electrolytic process.


2. What is hard gold plating?
Hard gold plating is a gold electrodeposit that has been alloyed with another element to alter the grain structure of the gold to achieve a harder deposit with a more refined grain structure.

The most common alloying elements used in hard gold plating are cobalt, nickel or iron.


3. What is the difference between Enig and hard gold?
ENIG plating is much softer than hard gold plating.

Grain sizes are about 60 times larger with ENIG plating, and hardness runs between 20 and 100 HK25.

ENIG plating holds up well at only 35 grams of contact force or less, and ENIG plating typically lasts for fewer cycles than hard plating.


A popular trend among manufacturers is board-to-board soldering.

This technique allows companies to produce integrated modules (often containing dozens of parts) on a single board that can be built into another assembly during production.

One easy way to produce a PCB that is destined to be mounted to another PCB is to create castellated mounting holes.

These are also known as "castellated vias" or "castellations."

China 10 Layers PCB Quick Turn Printed Circuit Boards Fr4 Material For Airplane supplier

10 Layers PCB Quick Turn Printed Circuit Boards Fr4 Material For Airplane

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