HC9P5504B-5 complex integrated circuits Integrated Circuit Chip EIA/ITU PABX SLIC with 40mA Loop Feed

EIA/ITU PABX SLIC with 40mA Loop Feed

The Intersil SLIC incorporates many of the BORSHT functions on a single IC chip. This includes DC battery feed, a ring relay driver, supervisory and hybrid functions. This device is designed to maintain transmission performance in the presence of externally induced longitudinal currents. Using the unique Intersil dielectric isolation process, the SLIC can operate directly with a wide range of station battery voltages.

The SLIC also provides selective denial of power. If the PBX system becomes overloaded during an emergency, the SLIC will provide system protection by denying power to selected subscriber loops.

The Intersil SLIC is ideally suited for the design of new digital PBX systems by eliminating bulky hybrid transformers.

Features

• Pin for Pin Replacement for the HC-5504

• Capable of 5V or 12V (VB+) Operation

• Monolithic Integrated Device

• DI High Voltage Process

• Compatible With Worldwide PBX Performance Requirements

• Controlled Supply of Battery Feed Current for Short Loops (41mA)

• Internal Ring Relay Driver

• Allows Interfacing With Negative Superimposed Ringing Systems

• Low Power Consumption During Standby

• Switch Hook Ground Key and Ring Trip Detection Functions

• Selective Denial of Power to Subscriber Loops

• Pb-free Available

Applications

• Solid State Line Interface Circuit for Analog and Digital PBX Systems

• Direct Inward Dial (DID) Trunks

• Voice Messaging PBXs

• Related Literature

- AN549, The HC-5502S/4X Telephone Subscriber Line Interface Circuits (SLIC)

- AN571, Using Ring Sync with HC-5502A and HC-5504 SLICs

Absolute Maximum Ratings (Note 1)

Maximum Continuous Supply Voltages

(V_B-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -60V to 0.5V

(V_B+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 15V

(V_B+ - V_B-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75V

Relay Drive Voltage (V_RD). . . . . . . . . . . . . . . . . . . . . . . -0.5V to 15V

Operating Conditions

Operating Temperature Range

HC-5504B-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 75°C

Relay Driver Voltage (V_RD) . . . . . . . . . . . . . . . . . . . . . . . . . 5 to 12V

Positive Supply Voltage (V_B+) . . . . . . . 4.75 to 5.25 or 10.8 to 13.2V

Negative Supply Voltage (V_B-) . . . . . . . . . . . . . . . . . . . . -42 to -58V

High Level Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V

Low Level Logic Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . 0.6V

Loop Resistance (R_L) . . . . . . . . . . . . . . . . . . . . . . . . . 200 to 1200Ω

Thermal Information

Thermal Resistance (Typical, Note 2) θJA (°C/W)

SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Maximum Junction Temperature (Plastic Packages) . . . . . . . 150°C

Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C

(SOIC - Lead Tips Only)

Die Characteristics

Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185

Diode Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 x 102

Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected

Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied.

2. θJA is measured with the component mounted on an evaluation PC board in free air.

Pinout

Functional Diagram

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