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tem | ||
Type of Alum board | single board, Insulation board, double sided board | |
Finish Board Thickness | 0.4mm----- 3.0mm | |
Copper Thickness | 1 OZ--6 OZ | |
Min.Trace Width & Line Spacing | 0.15mm | |
Biggest size | 120cm*60cm | |
Type for surface treatment | OSP.HASL, Immersion Gold ,Immersion Tin (lead free) | |
OSP | 0.20-0.40um | |
Thickness of Ni | 2.50-3.50um | |
Thickness of Au | 0.05-0.10um | |
Thickness of tin | 5-20um | |
Thickness of immersion silver | 0.15-0.40um | |
Thermal conductivity | 1.0W -----3.0W | |
Dielectric Thickness | 50um-150um | |
Thermal resistance | 0.05℃/W -1.7℃/W | |
Minimum completed hole dimension | ±0.10mm | |
Tolerance for Hole Diameter | ±0.075mm | |
Minimum Drilling Hole Diameter | φ0.8mm | |
Mask between pins | 0.15mm-0.35mm | |
Minimum spacing between Pad and Pad | 0.18mm-0.35mm | |
Outline tolerance | ±0.10mm | |
Minimum thickness for V-cut | 0.25mm | |
Outside copper thickness | 18-105um |