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Double-sided wave soldering 2D/3D AOI SMT Equipment 2D/3D AOI
1.PCB top and bottom detecton,simplify the manufacturing
process,reduce the factory labor and equipment costs
2.Solder plate positioning,FOV positioning with AI algorithm
automatic programming to simplify the process and
debugging,powerful solder joint inspection ability
3.Equipped with optical fiber beam sensor and side stop cylinder
can accurately stop the board,equipped with more stable side grab
pressure board best
4.Dual camera synchronous position,asynchronous interlock take
image to avoid up and down light source interference
Common Defects
1.Billboarding 2.Short circuit 3.Extra component 4.Print leakage
5.Insufficient solder
6.No solder 7.Tombstoning 8.Excess solder 9.Foreign material
10.Offset
DIP Defects DIP
1.Insufficient solder 2.Excess solder 3.Solder hole 4.Solder joint
5.Unavailabie pin 6.PIN deformation 7.Foreign material
8.Unavailabie pin
AOI Highlights
Component level pad positioning+DIP special AI algorithm ,support
one key setting of the same type of parameters
Due to the large number of DIP solder joints,this feature greatly
simplifies program optimization and debugging time