F4BTMS450 high frequency laminate built for hybridpcb, Multi Layer PCB Using in RF microwave application

Brand Name:F4B
Certification:ISO9001
Model Number:F4BTMS450
Minimum Order Quantity:1PCS
Delivery Time:2-10 working days
Payment Terms:T/T, Paypal
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Supplier`s last login times: within 1 hours
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Product Details

Product Description: F4BTMS450 4-Layer PCB


This newly shipped 4-layer PCB, constructed with F4BTMS450 material, is a high-reliability solution designed for demanding RF, microwave, and aerospace applications. Engineered with precision and built to meet IPC-Class-2 standards, this PCB offers a balance of advanced material properties and robust construction features. Below, we analyze its advantages and disadvantages in detail.



PCB Construction Details

ParameterSpecification
Base MaterialF4BTMS450
Layer Count4 layers
Board Dimensions20mm x 20mm (± 0.15mm)
Finished Thickness1.4mm
Copper Weight1oz (35μm) for all layers
Surface FinishImmersion Gold
Minimum Trace/Space4/5 mils
Minimum Hole Size0.3mm
Via Plating Thickness20μm
Solder MaskNone
SilkscreenNone
Electrical Testing100% tested before shipment

Advantages


F4BTMS450 has a dissipation factor (Df) of 0.0015 at 10GHz, ensuring minimal signal loss, making it ideal for high-frequency applications such as radar, microwave circuits, and satellite communication systems.


The PCB offers a Dk of 4.5 ± 0.09 at 10GHz, ensuring consistent signal integrity across a wide frequency range. This stability is critical for RF and phased array antenna designs.


With a thermal conductivity of 0.64 W/mK and a low thermal coefficient of Dk (-58 ppm/°C), the PCB maintains electrical performance even under thermal stresses.


The CTE values (X/Y: 12 ppm/°C, Z: 45 ppm/°C) ensure excellent dimensional stability, reducing warping during thermal cycling and improving reliability in high-temperature aerospace environments.


A low moisture absorption rate of 0.08% protects the board from performance degradation in humid or moisture-prone environments.


Versatile Applications:

The F4BTMS450 PCB is specifically designed for high-performance and mission-critical applications such as:

Aerospace systems: Space equipment, cabin systems, and satellite communications.

Microwave and RF applications: Radar systems, feed networks, and phased array antennas.

Military-grade designs: High-frequency radar and secure communication systems.


Disadvantages

Limited Protective Layers

Complex Manufacturing Requirements

Small Component Count

Cost Considerations


Conclusion

The F4BTMS450 4-layer PCB is an exceptional choice for high-frequency, high-reliability applications, particularly in aerospace and RF/microwave systems. Its advanced material properties, such as low loss, thermal stability, and dimensional integrity, make it ideal for mission-critical designs requiring precision and durability. However, the lack of protective layers, coupled with higher manufacturing costs, may limit its use in more general-purpose or cost-sensitive applications.


This PCB stands out as a specialized solution for cutting-edge industries requiring high-performance materials and reliable performance in demanding environments. For RF engineers and system designers, the F4BTMS450 4-layer PCB is a dependable option for next-generation communication systems.


China F4BTMS450 high frequency laminate built for hybridpcb, Multi Layer PCB Using in RF microwave application supplier

F4BTMS450 high frequency laminate built for hybridpcb, Multi Layer PCB Using in RF microwave application

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