CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers

CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Overview of CuClad 233 2-Layer PCB

The CuClad 233 PCB is a high-performance 2-layer rigid PCB built with Rogers CuClad 233 laminates, designed to provide superior electrical performance and mechanical stability. Featuring a 20mil core and a finished thickness of 0.6mm, this PCB is engineered for microwave and RF applications, offering a low dielectric constant (Dk) of 2.33 and a dissipation factor of 0.0013 at 10GHz.

With its balanced fiberglass/PTFE composite construction, the CuClad 233 PCB ensures dimensional stability, low insertion loss, and repeatable performance across wide frequency ranges. Its immersion gold finish enhances solderability and corrosion resistance, making it an ideal solution for radars, microwave components, and electronic countermeasures worldwide.

PCB Construction Details

PCB Stackup

The CuClad 233 PCB stackup is designed for optimal electrical performance while maintaining structural stability:

Introduction to CuClad 233 Material

Rogers CuClad 233 laminates are constructed using cross-plied woven fiberglass and PTFE composites, providing balanced electrical and mechanical properties. With a low dielectric constant (Dk) of 2.33 and dissipation factor of 0.0013, these laminates ensure low insertion loss and excellent dielectric uniformity. The cross-plied construction enhances dimensional stability, while the high PTFE-to-glass ratio supports consistent performance over a broad frequency range.

Key Features of CuClad 233

• Dielectric Constant (Dk): 2.33 at 10GHz/1MHz.
• Dissipation Factor: 0.0013 at 10GHz for minimal signal loss.
• Moisture Resistance: Low absorption rate of 0.02%.
• Peel Strength: High peel strength of 14 lbs/in for reliable bonding.
• Low Outgassing: Total mass loss (TML) and collected volatile condensable material (CVCM) are just 0.01%, ensuring suitability for space and vacuum applications.
• Dimensional Stability: Cross-plied construction provides unmatched stability compared to non-woven fiberglass laminates.

Benefits of CuClad 233

• Stable Electrical Properties: Consistent Dk and low loss across a wide frequency range.
• Reduced Circuit Losses: Supports wider line widths for lower insertion loss.
• Large PCB Support: Ideal for large-format designs like antennas.
• CTE Match with Aluminum: In-plane CTE matches aluminum, making it suitable for aircraft skins and structures.

Applications

Radars: Advanced radar systems for aerospace and defense.

Electronic Countermeasures (ECM): Reliable for military-grade signal disruption systems.

Microwave Components: Low noise amplifiers (LNAs), filters, couplers, and more.

Conclusion

The CuClad 233 2-layer PCB is a high-performance solution designed for RF and microwave systems, offering low dielectric constant, minimal signal loss, and mechanical stability. With its 20mil Rogers CuClad 233 core, 1oz copper layers, and immersion gold finish, this PCB ensures reliable performance for applications such as radars, electronic countermeasures, and microwave components.

Engineered to meet IPC-Class-2 standards and available worldwide, the CuClad 233 PCB is an excellent choice for engineers seeking a cost-effective, high-frequency PCB solution.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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