2-Layer TFA615 PCB 0.508mm Thin using PTFE ceramic composite dielectric material, Immersion Gold Finish for Power amplifiers

2-Layer TFA615 PCB: 0.6mm Thin, Immersion Gold Finish, and Aerospace-Grade High-Frequency Performance
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Overview of the 2-Layer TFA615 PCB
The 2-layer TFA615 PCB is a high-performance printed circuit board designed for aerospace, microwave, and radar applications. Manufactured using the TFA615 PTFE ceramic composite dielectric material, this PCB exhibits outstanding electrical, thermal, and mechanical properties. With a dielectric constant of 6.15, low dissipation factor, and minimal anisotropy, this material is optimized for high-frequency and high-reliability systems in demanding environments.

With a finished thickness of 0.6mm, immersion gold surface finish, and rigid structure, the TFA615 PCB meets IPC-Class-2 standards, making it an ideal solution for mission-critical applications in aerospace and satellite communications.



PCB Construction Details

PCB Stackup
The 2-layer TFA615 PCB stackup is engineered for superior RF and microwave performance, utilizing TFA615 material for its low dielectric loss and stable frequency characteristics. Below is the detailed layer structure:

PCB Statistics
The 2-layer TFA615 PCB is designed for high-density routing and efficient component placement, ensuring reliable performance for complex systems. Key statistics include:

• Components: 35
• Total Pads: 153
• Thru Hole Pads: 121
• Top SMT Pads: 32
• Bottom SMT Pads: 0
• Vias: 77
• Nets: 2

Introduction to TFA615 Material
TFA615 is a cutting-edge PTFE ceramic composite material, designed specifically for aerospace-grade applications. Unlike traditional fiberglass-reinforced laminates, TFA615 uses nano-ceramic particles and PTFE resin, eliminating the fiberglass effect on electromagnetic wave propagation. This results in exceptional frequency stability, low dielectric loss, and minimal anisotropy.

The material’s balanced X/Y/Z thermal expansion coefficients ensure dimensional stability, even in extreme environments, while its high thermal conductivity aids in efficient heat dissipation.


Features of TFA615

• Dielectric Constant (Dk): 6.15 ± 0.12 at 10GHz
• Dissipation Factor (Df):
• 0.0015 at 10GHz
• 0.0017 at 20GHz
• Thermal Conductivity: 0.8 W/mK
• CTE (Coefficient of Thermal Expansion):
• X-axis: 16 ppm/°C
• Y-axis: 16 ppm/°C
• Z-axis: 29 ppm/°C
• Range: -55°C to 288°C
• Moisture Absorption: 0.06%
• Thermal Decomposition Temperature (Td): 503°C
• UL Flammability Rating: UL 94-V0

Applications of TFA615 PCB

1. Aerospace Equipment: Used in space, in-cabin, and aircraft systems.
2. Microwave and Antenna Systems: Supports phase-sensitive and high-frequency antennas.
3. Radar Systems: Ideal for early warning and airborne radar systems.
4. Phased Array Antennas and Beamforming Networks: Enables precision in RF applications.
5. Satellite Communications: Provides consistent dielectric performance for navigation systems.
6. Power Amplifiers: Ensures efficient heat dissipation for high-power applications.

Why Choose the 2-Layer TFA615 PCB?
The 2-layer TFA615 PCB is the perfect choice for high-frequency and aerospace-grade applications. Its combination of advanced dielectric properties, minimal signal loss, and thermal reliability makes it a trusted solution in mission-critical systems.

Contact us today for more information or to place an order!

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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