6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask

6-Layer RO4003C/Tg170 FR-4 PCB: 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask

Overview of the 6-Layer RO4003C/Tg170 FR-4 PCB

The 6-Layer RO4003C/Tg170 FR-4 PCB is a highly durable and performance-optimized printed circuit board designed for demanding applications in cellular base stations, automotive radar, and RF systems. This PCB combines Rogers RO4003C and Tg170 FR-4 cores, offering exceptional thermal stability, low dielectric loss, and dimensional reliability. With 6.8mm finished thickness, immersion gold surface finish, and controlled-depth slots, the design ensures long-term reliability and optimal signal performance for high-frequency devices.

This multi-layer PCB is manufactured to IPC-Class-2 standards, ensuring consistent quality and worldwide availability. It's perfect for performance-sensitive, high-volume applications where precise electrical and thermal properties are critical.

PCB Construction Details

The 6-layer rigid PCB is built with a mix of RO4003C high-frequency laminate and Tg170 FR-4, providing a blend of high thermal conductivity and cost-effective manufacturability. Below is a detailed table of its construction specifications:

PCB Stackup

The stackup for this 6-layer rigid PCB alternates between high-performance RO4003C and cost-efficient Tg170 FR-4, ensuring thermal stability and dielectric uniformity. The detailed layer structure is as follows:

PCB Statistics

The 6-layer RO4003C/Tg170 FR-4 PCB is optimized for high-density component placement and reliable signal routing. Below are its key statistics:

• Components: 132
• Total Pads: 456
• Thru Hole Pads: 271
• Top SMT Pads: 166
• Bottom SMT Pads: 19
• Vias: 131
• Nets: 17

Introduction to RO4003C

The Rogers RO4003C laminate is a woven glass-reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE but with the manufacturability of epoxy-glass laminates. Its low dielectric constant (Dk) of 3.38 ± 0.05 and dissipation factor of 0.0027 at 10GHz make it ideal for high-frequency applications.

Key features of RO4003C include:

1. Low moisture absorption (0.06%) for reliable performance in humid environments.
2. Stable thermal expansion (CTE), ensuring excellent dimensional stability.
3. High thermal conductivity (0.71 W/m/K) for effective heat dissipation.

Applications

This PCB is ideal for applications requiring high-frequency stability and reliability, such as:

1. Cellular Base Station Antennas
2. Automotive Radar and Sensors
3. RF Identification Tags
4. LNBs for Direct Broadcast Satellites

With its 6-layer construction, RO4003C core, and immersion gold finish, the 6-layer RO4003C/Tg170 FR-4 PCB is the perfect choice for demanding RF and microwave systems. Its combination of durability, performance, and cost-efficiency makes it a standout solution for high-volume, performance-critical applications.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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