RO4003C Multilayer PCB 4-Layer 4.8mm Thick design for RF microwave circuits and matching networks and controlled impedance transmission lines
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Shenzhen Guangdong China
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6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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Bridging the Gap Between Electrical Performance and
Manufacturability
Designing high-frequency circuits requires a delicate balance
between electrical properties and fabrication considerations.
Traditionally, circuit board materials have often forced engineers
to compromise on one aspect or the other. However, the RO4003C
laminates represent a breakthrough in this regard, seamlessly
blending the superior electrical performance of PTFE/woven glass
with the ease of manufacturability associated with epoxy/glass
laminates.
Unparalleled Electrical Characteristics
At the heart of the RO4003C lies a dielectric constant (Dk) of 3.38
± 0.05, measured at 10 GHz, and a remarkably low dissipation factor
(Df) of 0.0027, also at 10 GHz. These stable and consistent
electrical properties make the RO4003C an exceptional choice for a
wide range of high-frequency applications, from microwave circuits
and matching networks to controlled impedance transmission lines.
Thermal Management Mastery
Thermal management is a critical consideration in high-frequency
designs, and the RO4003C delivers exceptional performance in this
regard. With a thermal conductivity of 0.71 W/m/°K and a low
thermal coefficient of dielectric constant (+40 ppm/°C), these
laminates ensure reliable operation even in the most demanding
operating environments, mitigating the risk of thermal-related
failures.
Dimensional Stability Redefined
Dimensional stability is paramount for high-frequency circuit
fabrication, and the RO4003C excels in this area. Its coefficient
of thermal expansion (CTE) is closely matched to copper, with an
X-axis of 11 ppm/°C and a Y-axis of 14 ppm/°C, ensuring a seamless
integration with copper traces and minimizing the risk of
deformation or failure during the manufacturing process.
Versatility and Cost-Effectiveness
The RO4003C materials are available in various configurations,
utilizing both 1080 and 1674 glass fabric styles, all meeting the
same exceptional electrical performance specification. This
versatility, combined with their non-brominated and non-UL 94 V-0
rated composition, makes the RO4003C an economically viable choice
for a wide range of high-frequency applications.
Empowering Innovation Across Diverse Industries
The RO4003C laminates have found their way into a diverse array of
high-frequency applications, from commercial airline broadband
antennas and millimeter-wave systems to radar guidance applications
and point-to-point digital radio antennas. Wherever the need for
high-performance, stable, and cost-effective circuit materials
arises, the RO4003C is poised to deliver exceptional results.
A Trusted Partner in High-Frequency Success
At Rogers Corporation, we take pride in our commitment to
innovation and customer success. As a senior sales manager, I've
seen firsthand how the RO4003C has transformed the design
possibilities for our customers, enabling them to push the
boundaries of what's achievable in high-frequency electronics.
If you're looking to elevate your high-frequency design to new heights, I invite you to discover the power of the Rogers RO4003C High Frequency Circuit Materials. Contact our sales team today to learn more about how these advanced laminates can unlock your design potential and drive your business forward.
RO4003C Multilayer PCB 4-Layer 4.8mm Thick design for RF microwave circuits and matching networks and controlled impedance transmission lines
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