Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
Brand Name:Bicheng Technologies Limited
Certification:UL
Model Number:BIC-460-V4.53
Minimum Order Quantity:1
Delivery Time:10 working days
Payment Terms:T/T, Paypal
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Supplier`s last login times:
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Product Details
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Product Details
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built
On 6 Layer With Blind Via for GPS Tracking
(Printed circuits boards are custom-made products, the picture and
parameters shown are just for reference)
1.1 General description
This is a type of 6 layer ultrathin printed circuit board built on
FR-4 substrate with Tg 135°C for the application of GPS Tracking.
It's only 0.6 mm thick without silkscreen on green solder mask
(Taiyo) and immersion gold on pads. The base material is from
Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.25mm are
resin filled and capped (via in pad). They're fabricated per IPC
6012 Class 2 using supplied Gerber data. Each 50 panels are packed
for shipment.
1.2 Features and benefits
1. Via in pad design reduced the inductive reactance and capacitive
reactance of the transmission line;
2. Immersion gold finish has high solderability, no stressing of
circuit boards and less contamination of PCB surface;
3. Products and manufacturing are certified by authorized
organizations;
4. Eligible products rate of first production: >95%;
5. Prototype PCB capability to volume production capability;
6. Delivery on time: >98%;
7. More than 18+ years of PCB experience;
8. IPC Class 2 / IPC Class 3;
1.3 Applications
Led Lighting
Intercom System
Portable WiFi Router
GSM Tracker
Commercial Led Lighting
Modem WiFi 4G
Honeywell Access Control
Electronic Access Control
Audio Frequency Amplifier
File servers
1.4 PCB Specifications
| PCB SIZE | 100 x 103mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 6 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP CS |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) GND Plane | |
| 4mil FR-4 | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 4mil FR-4 | |
| copper ------- 18um(0.5oz) SIG | |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) BOT PS | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 3mil/3mil |
| Minimum / Maximum Holes: | 0.22/3.50mm |
| Number of Different Holes: | 25 |
| Number of Drill Holes: | 2315 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT140 TG>135, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 0.6mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold 0.025µm over 3µm Nickel (14.4% area) |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, TAIYO PSR-2000 GT600D |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | No silkscreen requried. |
| Colour of Component Legend | No silkscreen requried. |
| Manufacturer Name or Logo: | No silkscreen requried. |
| VIA | Plated through hole(PTH), Blind via and via capping on CS and PS, vias not be visible. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 via in pad (VIP)
At present, the circuit board is becoming more and more dense and
interconnected, and there is no more room for these wires and pads
connecting the holes. Therefore, so in this context, the process of
punching the holes on the pads arises at the historic moment. In
brief, the via holes which have been plated through are plugged or
filled by insulating resin through the method of screen leakage,
and then drying, grinding, and then electroplating, so that the
whole surface of the PCB is coated with copper, and no longer via
holes can be seen.
The effect of via in pad is also very obvious: such as improved the
electrical performance and reliability of electronic products,
shorten the signal transmission wire, reduced the inductive
reactance and capacitive reactance of the transmission line, and
reduced internal and external electromagnetic interference.
Let’s see the basic process of via in pad.
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
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