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Introduction:
Welcome to the next generation of high-performance PCB materials.
We proudly present TLX-8, a game-changing solution designed to
revolutionize the world of advanced electronics. With its
outstanding properties and unwavering reliability, TLX-8 sets new
standards in the industry, empowering cutting-edge electronic
applications.
Unraveling Unparalleled Dielectric Prowess:
TLX-8 emerges as the undisputed champion of dielectric materials,
offering an unparalleled DK (dielectric constant) of 2.55 at 10
GHz. This remarkable attribute ensures swift and efficient signal
transmission. Equally impressive is its meager Df (dissipation
factor) of 0.0012 at 1.9 GHz and 0.0017 at 10 GHz, minimizing
signal loss and elevating electrical performance to unprecedented
heights.
Unyielding Mechanical Fortitude:
Prepare to be amazed by the resolute strength of TLX-8. Flexural
strength becomes its superpower, flexing its muscle at a staggering
28,900 psi (approximately 199.6 MPa) in the machine direction (MD)
and 20,600 psi (approximately 142.1 MPa) in the cross-direction
(CD). Brace yourself for the tensile strength of 35,600 psi
(approximately 245.3 MPa) in the MD and 27,500 psi (approximately
189.6 MPa) in the CD.
Uncompromising Resilience:
TLX-8 revels in its ability to withstand and endure. Exhibiting an
elongation at break of 3.94% in both the MD and CD directions, it
refuses to yield under pressure. Encapsulating this tenacity is its
Young's Modulus, a remarkable 980 kpsi (approximately 6,758 MPa) in
the MD and 1,200 kpsi (approximately 8,274 MPa) in the CD, truly
epitomizing stability and unyielding strength.
Thermal and Electrical Brilliance:
Behold TLX-8's thermal mastery, as it dissipates heat with
unparalleled finesse. With a thermal conductivity of just 0.19
W/M*K, it ensures optimal thermal management, a vital consideration
in high-power applications. Witness TLX-8's unwavering dimensional
stability, barely flinching under varying thermal stress
conditions, with minimal fluctuations in mils/inch (mm/M) in both
the MD and CD.
Reliability and Safety Uncompromised:
TLX-8 stands tall in the realm of reliability, boasting a
dielectric breakdown strength surpassing 45 kV. This impenetrable
barrier protects against electrical breakdown, fortifying the
longevity of electronic devices. Furthermore, with a moisture
absorption rate of a mere 0.02%, TLX-8 remains impervious to
environmental conditions that could compromise performance.
Igniting Innovation, Ensuring Safety:
TLX-8's UL-94 flammability rating of V-0 underscores its commitment
to unwavering safety standards. With a density of 2.25 g/cm3, it
offers a lightweight solution without compromising on performance,
igniting innovation while keeping environmental considerations at
the forefront.
Conclusion:
TLX-8 represents a paradigm shift in PCB materials, ushering in a
new era of excellence in advanced electronics. Its unmatched
dielectric properties, unwavering mechanical strength, exceptional
thermal conductivity, and steadfast reliability make it the
material of choice for those seeking superior performance and
durability. With TLX-8, engineers and designers can push the
boundaries of what's possible, forging a future where unimaginable
possibilities become reality.
Property | Test Method | Unit | TLX-8 Value | Unit | Value |
DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
Flammability Rating | UL-94 | V-0 | V-0 |