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engineered reliability with Rogers RO3006 PCB
When designing circuits requiring uncompromising thermal stability, Roger's RO3006 ceramic-filled PTFE composites set the industry standard.
Precise Formulation
A proprietary blend of high-purity PTFE resin and ceramic
microparticles yields RO3006's homogeneous structure. This
consistency results in its hallmark Dk stability from -55°C to over
200°C. Even minute shifts in the material properties can cause
design issues, so RO3006's uniformity across broad temperatures is
invaluable for mission-critical applications.
Optimal Mechanical Match
RO3006's incredibly low 17ppm/°C CTE perfectly mirrors standard
copper foil, eliminating delamination concerns. Thermal cycling
stresses are minimized, preserving electrical performance through
thousands of temperature fluctuations. Ruggedness paired with
RO3006's 0.79W/mK thermal conductivity also prevents component
overheating under high power loads.
Consistent Process Controls
All RO3006 materials are fabricated through Rogers' proprietary
fabrication process in an ISO 9001 certified facility. Tight
manufacturing specifications ensure lot-to-lot uniformity customers
can rely on. Post-lamination testing validates key parameters like
Dk, Df and CTE fall precisely within published spec limits.
Availability and Support
Standard RO3006 laminate and prepreg materials are stocked in
50mil, 1oz copper and 62mil/1oz copper configurations respectively
for quick turn prototyping. Experienced design engineers can also
assist with custom configurations for specialized high-frequency or
voltage requirements.
When demanding applications call for uncompromising stability, trust Rogers RO3006 to deliver fully-reliable designs generation after generation.