Name: High Tg Printed Circuit Board PCB Made on S10002M With Immersion Gold and 90 Ohm Impedance Control
Brand: Bicheng Technologies Limited
Price: 2.99 USD

China Categories

Home Products Suppliers Selling leads

English

Home /Products /Security & Protection /Access Control Systems & Products /Access Control Card Reader /

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

Brand Name:Bicheng Technologies Limited

Certification:UL

Model Number:BIC-505-V0.45

Minimum Order Quantity:1

Delivery Time:10 working days

Payment Terms:T/T, Western Union

Contact Now

Add to Cart

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member

Location: Shenzhen Guangdong China

Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Supplier`s last login times: within 1 hours

View Contact Details

Product Details Company Profile

Product Details

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M. It’s 6-layer board with 1 oz copper each layer, coating with hot air soldering level (HASL) and green solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.

Applications

Computers

Communications

Automotive electronics etc.

PCB Parameters

Item	Description	Requirement	Actual	Result
1. Laminate	Material Type	FR-4 S1000-2M	FR-4 S1000-2M	ACC
	Tg	170℃	170℃	ACC
	Supplier	SHENGYI	SHENGYI	ACC
	Thickness	1.6±10% mm	1.63-1.68mm	ACC
2.Plating thickness	Hole Wall	≥25µm	30.17µm	ACC
	Outer copper	35µm	41.09µm	ACC
	Inner Copper	30µm	33.69µm	ACC
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D	TAIYO/ PSR-2000GT600D	ACC
	Color	Green	Green	ACC
	Rigidity (Pencil Test)	≥4H or above	5H	ACC
	S/M Thickness	≥10 µm	20.11µm	ACC
	Location	Both Sides	Both Sides	ACC
4. Component Mark	Material Type	TAIYO/ IJR-4000 MW300	IJR-4000 MW300	ACC
	Color	White	White	ACC
	Location	C/S	C/S	ACC
5. Peelable Solder Mask	Material Type
	Thickness
	Location
6. Identification	UL Mark	YES	YES	ACC
	Date Code	WWYY	0421	ACC
	Mark Location	Solder Side	Solder Side	ACC
7. Surface Finish	Method	HASL Lead Free	HASL Lead Free	ACC
	Tin Thickness	3-6µm	4.06µm	ACC
	Nickel Thickness
	Gold Thickness
8. Normativeness	RoHS	Directive 2015/863/EU	OK	ACC
8. Normativeness	REACH	Directive 1907 /2006	OK	ACC
9.Annular Ring	Min. Line Width (mil)	6mil	5.8mil	ACC
9.Annular Ring	Min. Spacing (mil)	5mil	5.2mil	ACC
10.V-groove	Angle
10.V-groove	Residual thickness
11. Beveling	Angle
11. Beveling	Height
12. Function	Electrical Test	100% PASS	100% PASS	ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Visual Inspection	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Warp and Twist	≦0.7%	0.21%	ACC
14. Reliability Test	Tape Test	No Peeling	OK	ACC
	Solvent Test	No Peeling	OK	ACC
	Solderability Test	265 ±5℃	OK	ACC
	Thermal Stress Test	288 ±5℃	OK	ACC
	Ionic Contamination Test	≦ 1.56 µg/c㎡	0.56µg/c㎡	ACC

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code	PTH	Required	Actual value				Result
1	Y	0.375	0.375	0.400	0.400	0.375	ACC
2	Y	0.500	0.500	0.550	0.525	0.525	ACC
3	Y	0.7*2.4	0.7*2.4	0.7*2.41	0.69*2.4	0.7*2.4	ACC
4	Y	0.625	0.625	0.600	0.625	0.600	ACC
5	Y	0.725	0.725	0.725	0.750	0.725	ACC
6	Y	0.900	0.925	0.900	0.900	0.900	ACC
7	Y	1.000	1.000	0.950	0.975	1.000	ACC
8	N	1.050	1.050	1.050	1.075	1.050	ACC
9	Y	1.300	1.300	1.300	1.325	1.325	ACC
10	Y	1.350	1.350	1.325	1.350	1.325	ACC
11	Y	1.575	1.575	1.600	1.600	1.575	ACC
12	Y	1.650	1.650	1.700	1.675	1.675	ACC
13	Y	1.700	1.700	1.750	1.725	1.725	ACC
14	Y	3.250	3.250	3.250	3.275	3.250	ACC
15	Y	3.450	3.450	3.400	3.425	3.450	ACC
16	Y	0.7*2.6	0.7*259	0.7*2.61	0.69*2.6	0.7*2.59	ACC

Impedance Test Report

Sample NO.	Layer	Line Width(mil)±10%	Line Space (mil)±10%	Impedance Type		Required Value (ohm)	Tolerance	Actual Value	Result
Sample NO.	Layer	Line Width(mil)±10%	Line Space (mil)±10%	Single End	Differential	Required Value (ohm)	Tolerance	Actual Value	Result
1	L3	6.000	7.000		V	90.00	±10%	93.59	ACC
	L3	6.000	10.000		V	100.00	±10%	102.33	ACC
	L4	7.000	7.000		V	90.00	±10%	88.99	ACC
	L4	6.000	7.000		V	90.00	±10%	90.76	ACC

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main material partners