High CTI 600V PCB Built on 2.0mm FR-4 With HASL and Countersunk Holes
Brand Name:Bicheng Technologies Limited
Certification:UL
Model Number:BIC-499-V8.0
Minimum Order Quantity:1
Delivery Time:7 working days
Payment Terms:T/T, Paypal
Contact Now
Add to Cart
Site Member
Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
High CTI 600V PCB Built on 2.0mm FR-4 With HASL and Countersunk Holes
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Introduction
This is a type of single sided circuit board built on FR-4 substrate with CTI 600V. It is a 2.0mm thick PCB with simple tracks, green solder mask and white silkscreen. The surface finish on pads is hot air leveling, lead free type. There are 3 countersunk holes aligned on a track. The panel contains 12 individual boards.
PCB Specifications
| Item | Description | Value |
| 1. Laminate | Material Type | FR-4 CTI 600V |
| Tg | 135℃ | |
| Supplier | KB | |
| Thickness | 1.9-2.0mm | |
| 2.Plating thickness | Hole Wall | / |
| Outer copper | 41.09µm | |
| Inner Copper | / | |
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D |
| Color | Green | |
| Rigidity (Pencil Test) | 5H | |
| S/M Thickness | 20.11µm | |
| Location | Both Sides | |
| 4. Component Mark | Material Type | IJR-4000 MW300 |
| Color | White | |
| Location | C/S | |
| 6. Identification | UL Mark | YES |
| Date Code | 2121 | |
| Mark Location | Solder Side | |
| 7. Surface Finish | Method | HASL Lead free |
| Tin Thickness | 6.57µm | |
| 8. Normativeness | RoHS | OK |
| REACH | OK | |
| 9.Annular Ring | Min. Line Width (mil) | 4.8mil |
| Min. Spacing (mil) | 5.2mil | |
| 12. Function | Electrical Test | 100% PASS |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 |
| Visual Inspection | IPC-A-600J &6012D Class 2 | |
| Warp and Twist | 0.21% | |
| 14. Reliability Test | Tape Test | No Peeling |
| Solvent Test | No Peeling | |
| Solderability Test | 265 ±5℃ | |
| Thermal Stress Test | 288 ±5℃ | |
| Ionic Contamination Test | 0.56µg/c㎡ |
Applications
PDP, LCD , TV
Refrigerator
Power supplier
Washing machine
What is Comparative Tracking Index (CTI)?
Here CTI is a quality item that refers to copper clad laminate which is widely used in home electrical appliance or other high-voltage (110V, 220V) electrical apparatus.It is a simulated condition that the PCB is polluted in its working environment, which result in leakage or short-circuit at the track gap of the PCB surface, being accompanied by heat releasing and charring.
The way of experiment is that continous 50 drops of 0.1% ammonium chloride solution are dropped between two points on the PCB surface,30 seconds per drop,turning on high voltage AC current to do the test. Firstly trying 300V to generate 1A current. There's ammonium chloride solution on the surface, so after current is switched on it will produce resistance who also bring out heat, then the solution is slowly evaporated. 2nd drop is on and till to 50 drops to see if the PCB has leakage or not. Once the PCB has 0.1A creepage and exceeds 0.5 seconds, it's judged Failure.
The quality of CTI of laminate refers to the externally applied voltage value and without failure of 50 drops. If abovementioned 300V passed, we can increase the voltage to 400V, 500V or 600V till to the high value before failure, that is the data of the laminite CTI.
Bicheng offers high CTI PCB's (high CTI 600V FR-4 and aluminum backed material) which is working in such harsh environment of high voltage, filth and humidity.
IEC 112 standard has 3 degrees as follows
| Comparative Tracking Index (in Volts) | Class |
| 600 <= CTI | I |
| 400 <= CTI < 600 | II |
| 175 <= CTI < 400 | IIIA |
| 100 <= CTI < 175 | IIIB |
As per the standard of IEC,the smaller a substrate of CTI grade, the better resistance to tracking. Normal FR-4 ranges 175-225V
Data Sheet of FR-4 with CTI 600V
| Test Items | Test Method | Test Condition | Unit | Typical Value |
| Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 135 |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% W.L) | ℃ | 310 |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 2 |
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 15 |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃,solder dip | s | >100 |
| IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 55 | |
| CTE(Z-axis) | IPC-TM-650 2.4.24 | After Tg | ppm/℃ | 308 |
| IPC-TM-650 2.4.24 | 50-260℃ | % | 4.5 | |
| Permittivity (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 4.5 |
| Loss Tangent (1GHZ) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 0.017 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 5.0x108 |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 5.0x107 |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 126 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
| Peel Strength (1oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.8 [10.28] |
| Flexural Strength (LW/CW) | IPC-TM-650 2.4.4 | A | Mpa | 550/450 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.1 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| CTI | IEC60112 | A | Rating | PLC 0 (>600V) |
Bicheng PCB Capability (FR-4) 2022
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | FR-4 inclusive of Tg135℃, Tg150℃, High Tg 170℃, High CTI>600V etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-10oz) |
| Inner Copper Thickness | 17µm--420µm (0.5oz - 12oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
High CTI 600V PCB Built on 2.0mm FR-4 With HASL and Countersunk Holes
Inquiry Cart
0